Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Golam Rakib Mazumder"'
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In electronic packaging, lead-free solders often experience fatigue failures due to thermal-mechanical cyclic stress and strain caused by changing temperatures and mismatches in thermal expansion coefficients. As a result, damage accumulates in the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01b214826c11ec82036a29dfd27063ac
https://doi.org/10.1115/ipack2022-93878
https://doi.org/10.1115/ipack2022-93878
Autor:
Mohammad Ashraful Haq, Mohd Aminul Hoque, Golam Rakib Mazumder, Jeffrey C. Suhling, Pradeep Lall
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::369b825b846455a366bfd66a3a1871b4
https://doi.org/10.1109/ectc51906.2022.00235
https://doi.org/10.1109/ectc51906.2022.00235