Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Goh Chwee Sim"'
Autor:
Tekumalla, Sravya, Yang, Chen, Seetharaman, Sankaranarayanan, Wong, Wai Leong Eugene, Goh, Chwee Sim, Shabadi, Rajashekara, Gupta, Manoj
Publikováno v:
In Journal of Alloys and Compounds 25 December 2016 689:350-358
Autor:
Seetharaman, Sankaranarayanan, Blawert, Carsten, Ng, Baoshu Milton, Wong, Wai Leong Eugene, Goh, Chwee Sim, Hort, Norbert, Gupta, Manoj
Publikováno v:
In Journal of Alloys and Compounds 5 November 2015 648:759-770
Autor:
Teck Kheng Lee, Kwok Weng Jimmy Chan, Khin Sandar Tun, Goh Chwee Sim, Manoj Gupta, XingHe Tan, Wai Onn Richard Kwok
Publikováno v:
Advanced Materials Research. 1119:613-616
Crystalline Mg-Cu-Y alloy system was fabricated using the squeeze casting technique. Microstructure showed the multiphase structure composed of primary Mg rich phase distributed among the lamellae patterns, alternative layers of LPSO Mg phase and int
Autor:
Teck Kheng Lee, Chan Kwok Jimmy Weng, XingHe Tan, Manoj Gupta, Kwok Wai Richard Onn, Goh Chwee Sim, Khin Sandar Tun
Publikováno v:
Applied Mechanics and Materials. 597:135-139
Magnesium (Mg) alloys with 30 weight percentage (wt.%) of yttrium (Y) were gravity cast using copper mold and copper mold with air cooling. The results were benchmarked with Mg-30Y alloys produced using steel mold casting. It was found that the Mg-30
Publikováno v:
Materials Science Forum. :475-478
NiTi is proposed to be a biomaterial suitable for bone replacements. Reactive synthesis, Self-Propagating High-Temperature Synthesis (SHS) of NiTi from Ni and Ti powder is a suitable method to prod ...
Akademický článek
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Publikováno v:
In Corrosion Science 2010 52(5):1551-1553
Autor:
Goh, Chwee Sim.
The objective of this research is to investigate the cyclic deformation behavior of super duplex stainless steel. This research made use of sophisticated equipment such as TEM to understand the effect of fatigue on the deformation behaviour of super
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1392::a5250256776da7d5950174aacf56ed62
http://hdl.handle.net/10356/5049
http://hdl.handle.net/10356/5049
Akademický článek
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Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging; 1/ 1/2012, p244-249, 6p