Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Glenn Y Masada"'
Autor:
Matthew Clayton Such, Glenn Y Masada
Publikováno v:
2017 IEEE Power & Energy Society General Meeting.
This paper compares lead compensation and droop control of a 10MW lithium-ion based battery energy storage system (BESS) designed to maintain load frequency control (LFC) by dispatching regulating reserves of active power to a 91MW test section of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5df5ba7151dabde2c0009a0022aa7545
https://doi.org/10.1109/pesgm.2017.8274644
https://doi.org/10.1109/pesgm.2017.8274644
Publikováno v:
Journal of Thermal Science and Engineering Applications. 8
A residential hybrid ground source heat pump (HGSHP) model is presented, which integrates a compact cooling tower with a GSHP. The base case GSHP model is for a single story, 195 m2 house with a 14 kW heat pump and four 68.8 m deep vertical boreholes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8144c89fda518863bcdb2d43998b2b92
https://doi.org/10.1115/1.4032763
https://doi.org/10.1115/1.4032763
Autor:
Glenn Y. Masada, Richard D. Braatz
Publikováno v:
IEEE Control Systems. 30:124-132
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e6140ef1c5ddcb9307cc73c1820e147
https://doi.org/10.1109/mcs.2010.938488
https://doi.org/10.1109/mcs.2010.938488
Autor:
Kwan-Woong Gwak, Glenn Y Masada
Publikováno v:
Journal of Dynamic Systems, Measurement, and Control. 126:574-582
New regularization embedded nonlinear control designs are proposed for the temperature control of an input-constrained and ill-conditioned thermal process. A classic nonlinear controller applied to such a process is shown to provide good temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1cca561ed8cd2f06b69546ea3f4d7bd7
https://doi.org/10.1115/1.1789973
https://doi.org/10.1115/1.1789973
Structural Analysis and Optimization of Nonlinear Control Systems Using Singular Value Decomposition
Autor:
Glenn Y Masada, Kwan-Woong Gwak
Publikováno v:
Journal of Dynamic Systems, Measurement, and Control. 127:105-113
Structural information of a system/controller allows a designer to diagnose performance characteristics in advance and to make better choices of solution methods. Singular value decomposition (SVD) is a powerful structural analysis tool for linear sy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a95a2e023912f41c76de67147dddd022
https://doi.org/10.1115/1.1876495
https://doi.org/10.1115/1.1876495
Publikováno v:
Journal of Thermal Science and Engineering Applications. 6
An integrated building load-ground source heat pump model is developed to capture short-term (30 s) and long-term (10–20 yr) performance of ground source heat pumps with vertical boreholes. The model takes advantage of the built-in computation and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf88460b02f2f01b12bfbe1732e62e0e
https://doi.org/10.1115/1.4026081
https://doi.org/10.1115/1.4026081
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 19:127-133
A finite element structural model is developed to predict the thermomechanical behavior of printed circuit board (PCB) assemblies during infrared reflow soldering. Specifically, the model predicts the amount of board warpage, the effects of increased
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::463a0986211f762137e5b1bb626ad353
https://doi.org/10.1109/95.486624
https://doi.org/10.1109/95.486624
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 8:352-359
The viability of using a nondestructive micro-shear test to resolve interfacial features in integrated circuits incorporating TAB (tape automated bonding) technology has been confirmed using finite element method (FEM) simulations. Both two- and thre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efcaa512a19abff9c23f405d347385fa
https://doi.org/10.1109/66.401013
https://doi.org/10.1109/66.401013
Publikováno v:
Journal of Dynamic Systems, Measurement, and Control. 117:1-7
Extended Bond Graph (EBG) reticulations for general and linear piezoelectric continua are developed in this paper. The EBG formulation is especially advantageous for modeling the distributed coupled electromechanical effects of these materials and fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cae63de02ea3ea9ef12b1eb424c4250
https://doi.org/10.1115/1.2798518
https://doi.org/10.1115/1.2798518
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:192-200
In the wafer bumping process, metal bumps are deposited on aluminum pads and are later used to bond the silicon die to the I/O connections. The bump strength is important for the mechanical integrity and overall reliability of the interconnect. In th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b73dcc128cf77fdbc79313b9be8ddeea
https://doi.org/10.1109/96.365508
https://doi.org/10.1109/96.365508