Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Glenn A. Rinne"'
Publikováno v:
International Symposium on Microelectronics. 2017:000176-000181
A method for directly measuring the silicon strain in a flip chip ball grid array (FCBGA) package is disclosed. The method uses anisotropically etched holes in the die backside to reveal fiducial crosses on the front side of the die. A geometric mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f47e447135e59035e77a460a5762acf
https://doi.org/10.4071/isom-2017-wa14_097
https://doi.org/10.4071/isom-2017-wa14_097
Autor:
Glenn A. Rinne
Publikováno v:
Microelectronics Reliability. 43:1975-1980
The relentless progress of semiconductor integration is reducing the area required for circuits. As die size shrinks the area available for power and ground bumps on wafer-level chip-scale packages (WLCSPs) also shrinks and, with fewer power bumps, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a373c2cbd5cbd21ec228a14bbca90fb4
https://doi.org/10.1016/j.microrel.2003.09.001
https://doi.org/10.1016/j.microrel.2003.09.001
Autor:
Chul Woo Park, Glenn A. Rinne, Choonheung Lee, Ga Won Kim, Ji Heon Yu, Jin Young Kim, Seoung Joon Hong
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
In this paper, the 8+1-layer coreless substrate of fcBGA will be introduced, which was revised from the 12-layer core substrate. This coreless substrate was manufactured in Shinko using an advanced ABF film (GZ41) having low CTE for lower warpage and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65e2f96ae5bf3a3e395afbe9a13638a8
https://doi.org/10.1109/ectc.2012.6248941
https://doi.org/10.1109/ectc.2012.6248941
Publikováno v:
Proceedings of the International Conference on Multichip Modules.
Flip chip interconnections provide the highest interconnection density possible which makes this technology very attractive for use with multichip modules. However, several factors have hindered the use of this technology. These factors include the a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6db2c22fc266b3d2cfb55d7159dcf95a
https://doi.org/10.1109/icmcm.1994.753527
https://doi.org/10.1109/icmcm.1994.753527
Autor:
Glenn A. Rinne
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Electromigration is the movement of metal atoms in the direction of current flow. It is caused by the transfer of momentum from the passing electrons to atoms in the lattice. First discovered in thin-film aluminum conductors some thirty years ago, el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dca7d662677e69683c6d6c7a0f0725aa
https://doi.org/10.1109/ectc.2004.1319457
https://doi.org/10.1109/ectc.2004.1319457
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
As WLCSP packaging technology travels the road to ubiquity a transition is unfolding. WLCSP designs and material selection paradigms are moving from a process integration focus to one of product integration. The transition is driven by the applicatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f8defab0337bce6fd7b0f6253ae096c
https://doi.org/10.1109/ectc.2004.1320313
https://doi.org/10.1109/ectc.2004.1320313
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
An investigation was conducted to examine the use of thin inorganic dielectric films as barrier layers between copper and polyimide. The emphasis was on discovering the effectiveness of the barrier layers in preventing copper-polyimide interaction an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcafe0c976041a4572da135cc85222d6
https://doi.org/10.1109/ectc.1992.204293
https://doi.org/10.1109/ectc.1992.204293
Publikováno v:
Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).
Despite the current high level of interest in flip chip technology there remain many obstacles to its widespread acceptance. These include among others: 1) the cost of the bumping, 2) the cost for redistribution 3) reliability data on the assembled p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c05bd4e40c37ac192ac6171479b87611
https://doi.org/10.1109/mcmc.1996.510764
https://doi.org/10.1109/mcmc.1996.510764
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
Improvements in PCB technology and the demand for smaller form factor at lower cost have provided the primary motivation for interest in flip chip on board (FCOB) assembly. With the development of direct chip attach (DCA) technology using high-lead s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b3c898719028ca1eafe82e1eff5bd93
https://doi.org/10.1109/isapm.1998.664445
https://doi.org/10.1109/isapm.1998.664445
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
Packaging of electronic components is in a transitional phase due to the relentless progress of transistor integration that is going on in the semiconductor environment. While all manufacturers may want to transition directly to flip chip, for a numb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f05aad4e5ff470094f831a3a4f26a8d
https://doi.org/10.1109/isapm.1998.664436
https://doi.org/10.1109/isapm.1998.664436