Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Glenn A. Biery"'
Autor:
Laertis Economikos, Gerhard Lembach, Fen Chen, Dimitri R. Kioussis, Moosung Chae, Thom Gow, Theo Standaert, Jihong Choi, Vinayan C. Menon, Youngjin Choi, Joseph Linville, Wai-kin Li, Ravi Prakash Srivastava, Ronald G. Filippi, Edward Engbrecht, Sujatha Sankaran, Vincent J. McGahay, Wei-Tsu Tseng, Lee M. Nicholson, Kenneth M. Davis, Glenn A. Biery, Naftali E. Lustig, Anthony D. Lisi, Hermann Wendt, Kaushik A. Kumar, Kaushik Chanda, P. McLaughlin, Oscar Bravo, William F. Landers, Frieder H. Baumann, Tibor Bolom, Andrew H. Simon, Allen H. Gabor, Carsten Peters, Craig Child
Publikováno v:
MRS Proceedings. 1079
A tool has been developed that can be used to characterize or validate a BEOL interconnect technology. It connects various process assumptions directly to electrical parameters including resistance. The resistance of narrow copper lines is becoming a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2407a7a769197d96ae3e99aa87c2ec1a
https://doi.org/10.1557/proc-1079-n02-01
https://doi.org/10.1557/proc-1079-n02-01
Autor:
Glenn A. Biery, Zachary Baum, Bachir Dirahoui, Mike D. Monkowski, Deborah A. Ryan, Atsushi Ogino, Oliver D. Patterson, Shuen-Cheng Chris Lei, Jim Shih-Chun Liang, David Conklin
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 14:021106
Early in-line detection of systematic patterning problems in technology development can dramatically improve a technology’s chance for success. By uncovering layout geometries that are difficult to implement, prompt action may be taken so that solu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c27c5e2ea771780cff82872aa6e13758
https://doi.org/10.1117/1.jmm.14.2.021106
https://doi.org/10.1117/1.jmm.14.2.021106
Autor:
Sanjit K. Das, Jia Lee, Glenn A. Biery, Ronald D. Goldblatt, John A. Fitzsimmons, Wei-Tsu Tseng, Edward Barth
Publikováno v:
MRS Proceedings. 732
Hydrogenated silicon nitride, hydrogenated silicon carbide, and their intermediates were chemo-mechanically polished. Results showed that, within the material set examined, harder materials also have higher CMP removal rates. In addition, CMP rates f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc4aa96b62ffd38cce1e5a216382b474
https://doi.org/10.1557/proc-732-i1.7
https://doi.org/10.1557/proc-732-i1.7
Publikováno v:
MRS Proceedings. 309
The 1/f noise in heat-treated Al and AI-Cu thin films was investigated at a current density of 20 mA/μm2 from approximately RT to 200 C. The results were consistent with the Dutta-Dimon-Hom model, i.e., the noise is the result of a collection of two
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef97256edf52822c0bd3075114127468
https://doi.org/10.1557/proc-309-313
https://doi.org/10.1557/proc-309-313
Publikováno v:
MRS Proceedings. 309
Several phenomena related to the short-length effect were observed during lifetime measurements of a two-level structure consisting of Ti-AICu-Ti stripes connected by interlevel tungsten (W) stud-vias. A linear increase in resistance was followed by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01d0e35e89f007b8bd6a4b23a089cab5
https://doi.org/10.1557/proc-309-141
https://doi.org/10.1557/proc-309-141
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