Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Glen Mori"'
Publikováno v:
JMIR Formative Research, Vol 8, p e58241 (2024)
BackgroundOnline mental health communities (OMHCs) are an effective and accessible channel to give and receive social support for individuals with mental and emotional issues. However, a key challenge on these platforms is finding suitable partners t
Externí odkaz:
https://doaj.org/article/0c01679078fb43b5b722c0bd2cb429e9
Publikováno v:
The Pediatric Infectious Disease Journal. 16:619-622
Autor:
Hiram Cervera, Harry J. Levinson, Glen Mori, Thomas I. Wallow, Jongwook Kye, Charles R. Szmanda, Ryoung-han Kim, Junyan Dai, Nikolaos Bekiaris, Chi Truong
Publikováno v:
Advances in Resist Materials and Processing Technology XXVI.
We describe progress in low-k 1 factor double patterning using 172 nm ultraviolet (UV) curing as a resist stabilization method. Factors that have contributed to enhanced patterning capability include a) resists design and optimization for both patter
Publikováno v:
Advances in Resist Materials and Processing Technology XXVI.
This study reports on blob defect reduction and process impacts by Acid Rinse System. Blob defects that appear after develop are a common problem with i-line, KrF, ArF and ArF-immersion resists. Last year we reported Blob defects were influenced by t
Autor:
Joseph Kennedy, Songyuan Xie, Hiram Cervera, Ze-Yu Wu, Thomas Wallow, Junyan Dai, Kyle Flanigan, Nikolaos Bekiaris, Ron Katsanes, Glen Mori
Publikováno v:
Advances in Resist Materials and Processing Technology XXVI.
As IC manufactures explore different paths to meet the resolution requirements for next generation technology, patterning schemes which utilize a double photoresist patterning process are under extensive evaluation. One dual patterning process under
Publikováno v:
Advances in Resist Materials and Processing Technology XXVI.
There is a limit to the minimum feature size that can be printed using current lithographic techniques. For that reason, engineers often employ various shrink methods in production to reduce the size of features generated by lithography. One such tec