Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Girish Wable"'
Autor:
Girish Wable, Daniel Gamota, Nicholas Arnal, Thomas P. Ketterl, Hue Thai, William Garon, Thomas M. Weller
Publikováno v:
2015 IEEE 16th Annual Wireless and Microwave Technology Conference (WAMICON).
This paper describes a study of dielectric and metallic 3D printing (additive manufacturing) processes that are candidates for digital manufacturing of integrated mobile phone client antennas. The integration of antennas into the packaging of commerc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5db893f2ad6a47a3999569a3958647f5
https://doi.org/10.1109/wamicon.2015.7120425
https://doi.org/10.1109/wamicon.2015.7120425
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 29:202-210
Environmental and health concerns, due to the leaching of lead from landfills into ground water, have necessitated legislation that restricts the use of lead in electronics. The transition from the eutectic tin-lead composition used in electronic sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccc0e344722ac29fd52228509950010c
https://doi.org/10.1109/tepm.2006.882500
https://doi.org/10.1109/tepm.2006.882500
Publikováno v:
Soldering & Surface Mount Technology. 17:32-39
PurposeHistorically, tin‐lead solder has been a commonly used joining material in electronics manufacturing. Environmental and health concerns, due to the leaching of lead from landfills into ground water, have necessitated legislation that restric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::627bc1a3016bacc04a3004441e7c053f
https://doi.org/10.1108/09540910510597483
https://doi.org/10.1108/09540910510597483