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pro vyhledávání: '"Girish Kumar, Mekala"'
Autor:
Bhatti, Gulafsha, Pathade, Takshashila, Agrawal, Yash, Palaparthy, Vinay, Gohel, Bakul, Parekh, Rutu, Girish Kumar, Mekala
Publikováno v:
IETE Journal of Research; Mar2024, Vol. 70 Issue 3, p2878-2893, 16p
Akademický článek
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In recent years, carbon nanotube (CNT) interconnects have emerged as a potential alternative to copper interconnects due to their several magnificent properties. Due to fabrication issues, realization of densely packed CNTs with uniform diameters in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6009987c5881525c8fedcc3d589dc01c
https://doi.org/10.4018/978-1-7998-1393-4.ch009
https://doi.org/10.4018/978-1-7998-1393-4.ch009
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:111002
The approach of monolithic 3D IC (M3D) integration using monolithic inter-tier-vias (MIVs) as interconnect structures is considered. Although, M3D ICs show many benefits of heterogeneous integration without significant area overhead compared to 3D IC
Publikováno v:
IET Circuits, Devices & Systems. 11:232-240
In this work, performance of dielectric inserted side contact multilayer graphene nanoribbon (Di-side-GNR) coupled interconnects using unconditionally stable finite-difference time-domain (USFDTD) technique has been investigated. The model developed
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. Feb2017, Vol. 59 Issue 1, p217-227. 11p.