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Autor:
Lavinia Motta, Parikshit Sharma, Andrea Corno, Annalisa Bordogna, Paolo Piacentini, Paolo Parisi, Francesco Ferrario, Giovanna Pistone, Thomas Groos, Bernardo Micali, Alberto Beccalli, Simona Seminato, Loemba Bouckou
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
Appropriate solutions for post-lithographic defect management and process tool control are fundamental to ensure better chip quality and yield maintenance through the reduction of wafers at risk. The increasing demand in terms of wafer production cap