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pro vyhledávání: '"Giovai Battista Preve"'
Autor:
Laetitia Adelmini, Michael Hofbauer, Jong Moo Lee, Olivier Lemonnier, Claudio J. Oton, Stefano Tondini, Philippe Velha, Paolo Pintus, Francesco Testa, Gabriel Pares, Giovai Battista Preve, Jose Angel Ayucar, C. L. Manganelli, Astghik Chalyan, Stefano Stracca, Horst Zimmermann, Bernhard Goll, Nikola Zecevic, Lorenzo Pavesi, Alberto Bianchi, Christophe Kopp, Aina Serrano, Guido Chiaretti, Min-su Kim, Giorgio Fontana
Publikováno v:
IEEE Photonics Technology Letters. 30:681-684
An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are 3D-integrated. The EIC using the complementary metal–oxide–semiconductor (CMOS) part of STMicroelectronics’ BCD8sp $0.16~\mu \text{m}$ technology control
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::37988fb2578693cf2facd07bb632f973
https://doi.org/10.1109/lpt.2018.2811464
https://doi.org/10.1109/lpt.2018.2811464
