Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Gilles Poupon"'
Autor:
Christophe Brun, Xavier Baillin, Aurelie Thuaire, Delphine Sordes, Corentin Carmignani, Emmanuel Rolland, Patrick Reynaud, Severine Cheramy, Gilles Poupon
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1804-1814
With their attractive intrinsic properties, such as morphology, autoassembling properties, and tailorability, nano-objects could provide alternative and innovative routes to current microelectronics and nanoelectronics. Further insight on their elect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3b3fe19c53d4976bff9b606d3a450b3
https://doi.org/10.1109/tcpmt.2016.2633420
https://doi.org/10.1109/tcpmt.2016.2633420
Autor:
Cedrick Chappaz, T. Frank, F. Lorut, Gilles Poupon, Lucile Arnaud, Lorena Anghel, P. Leduc, Stephane Moreau, Aurelie Thuaire, E. Chery
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, 2013, 53 (1), pp.17-29. ⟨10.1016/j.microrel.2012.06.021⟩
Microelectronics Reliability, Elsevier, 2013, 53 (1), pp.17-29. ⟨10.1016/j.microrel.2012.06.021⟩
Microelectronics Reliability, 2013, 53 (1), pp.17-29. ⟨10.1016/j.microrel.2012.06.021⟩
Microelectronics Reliability, Elsevier, 2013, 53 (1), pp.17-29. ⟨10.1016/j.microrel.2012.06.021⟩
International audience; In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu TSV-last approach of 2 μm diameter and 15 μm of depth. Thermal cycling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f698ff343b6c8957e4ed47c8509a0371
https://doi.org/10.1016/j.microrel.2012.06.021
https://doi.org/10.1016/j.microrel.2012.06.021
This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic sc
Autor:
Gilles Poupon
Publikováno v:
Électronique.
La conception de nouveaux modes d’integration et l’emploi de methodes collectives pour realiser des composants electroniques ont eu un impact majeur sur l’evolution des procedes d’encapsulation et d’interconnexion associes. Cet article pass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83a7e66a35673dd43f3e13cc0ed7b792
https://doi.org/10.51257/a-v1-e3401
https://doi.org/10.51257/a-v1-e3401
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:813-824
System integration, performance, cost and enhanced product functionality form the major driving forces behind contemporary innovations in packaging. The need for miniaturization has led to new architectures which combine a whole range of different te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f01886fd33aa3cba8de35b0e8947aeb8
https://doi.org/10.1109/tcpmt.2011.2109719
https://doi.org/10.1109/tcpmt.2011.2109719
Autor:
Charlotte Gillot, David Henry, P. Leduc, Barbara Charlet, L. Di Cioccio, Gilles Poupon, Alan Mathewson, Maud Vinet, N. Sillon, Perrine Batude
Publikováno v:
Proceedings of the IEEE. 97:60-69
System integration is clearly a driving force for innovation in packaging. The need for miniaturization has led to new architectures that combine disparate technologies and materials. Today several different approaches have been developed. These incl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5acdc7471b40f218955d3236b112a105
https://doi.org/10.1109/jproc.2008.2007464
https://doi.org/10.1109/jproc.2008.2007464
Publikováno v:
La Houille Blanche. 89:62-66
La miniaturisation et l'amelioration des performances des composants electroniques conduisent a l'augmentation des densites de puissance qu'ils dissipent, rendant necessaire le developpement de systemes de refroidissement adaptes. Dans cet article, n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27b9d172ebf6a76083334ecb2a016f7f
https://doi.org/10.1051/lhb/2003077
https://doi.org/10.1051/lhb/2003077
Autor:
Gilles Poupon
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b56848fb5e364c6994d20408af103a72
https://doi.org/10.1109/impact.2010.5699502
https://doi.org/10.1109/impact.2010.5699502
Autor:
Gilles Poupon
Publikováno v:
Traitements des métaux.
Historiquement, les technologies de packaging des puces de micro-electronique pouvaient prendre en compte un montage par la face arriere des puces sur le circuit, pour la simple raison que les performances des dispositifs electroniques n'etaient pas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d479b97c5361e11805ef440872068146
https://doi.org/10.51257/a-v1-m1752
https://doi.org/10.51257/a-v1-m1752
Autor:
M.C. Saint-Lager, Jean‐Luc Ferrer, Michel Roth, Eric Fanchon, Jean-François Berar, Gilles Poupon
Publikováno v:
Review of Scientific Instruments. 66:2089-2091
High intensity for diffraction experiments with high energy resolution, on an intense source like bending magnet at the European Synchrotron Radiation Facility, requires a strict control of the curvature of the optical elements placed in the beam for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71878fa23b99f51f3bb5330507beac79
https://doi.org/10.1063/1.1145737
https://doi.org/10.1063/1.1145737