Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Gilbert Shelden"'
Publikováno v:
SPIE Proceedings.
Microelectronics industry leaders routinely name mask cost and cycle time as top issues of concern. In 2002, a survey was created with support from SEMATECH and administered by SEMI North America to gather information about the mask industry as an ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f20134d01566cbdff6f4186a267f3fd1
https://doi.org/10.1117/12.798511
https://doi.org/10.1117/12.798511
Publikováno v:
SPIE Proceedings.
Microelectronics industry leaders routinely name the cost and cycle time of mask technology and mask supply as top critical issues. A survey was created with support from SEMATECH and administered by SEMI North America to gather information about the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5add6b0ed67df1c6f9ae306fc6b5e893
https://doi.org/10.1117/12.730158
https://doi.org/10.1117/12.730158
Publikováno v:
23rd European Mask and Lithography Conference.
Microelectronics industry leaders routinely name the cost and cycle time of mask technology and mask supply as top critical issues. A survey was created with support from SEMATECH and administered by SEMI North America to gather information about the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64619450da947526cb66904484647387
https://doi.org/10.1117/12.731817
https://doi.org/10.1117/12.731817
Publikováno v:
SPIE Proceedings.
Microelectronics industry leaders routinely name the cost and cycle time of mask technology and mask supply as top critical issues. A survey was created with support from SEMATECH and administered by SEMI North America to gather information about the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c5f79d855ff9e08032839d1f37517d5
https://doi.org/10.1117/12.684179
https://doi.org/10.1117/12.684179
Publikováno v:
22nd European Mask and Lithography Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7db29758d04d120039cfb5ff67cbcab
https://doi.org/10.1117/12.692628
https://doi.org/10.1117/12.692628
Autor:
Scott D. Hector, Gilbert Shelden
Publikováno v:
SPIE Proceedings.
Microelectronics industry leaders routinely name mask cost and cycle time as top issues of concern. A survey was created with support from International SEMATECH (ISMT) and administered by SEMI North America to gather information about the mask indus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33a6bce9512ce1b5b33e03513c341460
https://doi.org/10.1117/12.613333
https://doi.org/10.1117/12.613333
Autor:
Scott D. Hector, Gilbert Shelden
Publikováno v:
SPIE Proceedings.
Microelectronics industry leaders routinely name mask cost and cycle time as top issues of concern. A survey was created with support from International SEMATECH (ISMT) and administered by SEMI North America to gather information about the mask indus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2de208574701e43f93407be59107b0f
https://doi.org/10.1117/12.565034
https://doi.org/10.1117/12.565034
Publikováno v:
SPIE Proceedings.
Chrome-based absorbers have been the mainstay of the photomask industry for three decades. While chrome is attractive because of its durability and opacity, it conversely poses challenges for etch and repair. Due to large capital investments, any new
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f5a9620b00473a032e64a899c0461ef
https://doi.org/10.1117/12.565124
https://doi.org/10.1117/12.565124
Publikováno v:
Extreme Ultraviolet Lithography (TOPS).
The key issues in reticle manufacturing are cost and delivery time, both of which are dependent upon the yield of the process line. To estimate the cost and delivery time for EUVL reticles in commercial manufacturing, we have developed the first mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9c2eccaabc4fe2a666b01f48c6401dd
https://doi.org/10.1364/eul.1996.r54
https://doi.org/10.1364/eul.1996.r54