Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Gilbert See"'
Autor:
Sefa Dag, Liu Jiang, Prayudi Lianto, Gilbert See, Jinho An, Raghav Sreenivasan, Arvind Sundarajjan, Buvna Ayyagari-Sangamalli, El Mehdi Bazizi
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::654a98c50146ff69154b7c717b23211c
https://doi.org/10.1109/eptc56328.2022.10013200
https://doi.org/10.1109/eptc56328.2022.10013200
Autor:
Srikrishna Sitaraman, Liu Jiang, Sefa Dag, Mohammad Masoomi, Ying Wang, Prayudi Lianto, Jinho An, Ruiping Wang, Gilbert See, Arvind Sundarrajan, El Mehdi Bazizi, Buvna Ayyagari-Sangamalli
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ef087289b36d625afb32af4573ee8b5
https://doi.org/10.1109/ectc51906.2022.00116
https://doi.org/10.1109/ectc51906.2022.00116
Autor:
Wiswell Nicholas, Prayudi Lianto, Masaya Kawano, Xiangyu Wang, Vivek Chidambaram, Gilbert See
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Wide range of choices are available for dielectric materials selection for hybrid bonding, which include: thermal oxide, PECVD TEOS SiO 2 , SiN, SiCN and commercial polymer dielectrics. Among the polymer dielectrics, two types: high-temperature curab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9418f0817e4b58587897b7fd93edd29d
https://doi.org/10.1109/ectc32696.2021.00078
https://doi.org/10.1109/ectc32696.2021.00078
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper presents the demonstration of integrated passive devices on a 300mm mold-first FOWLP technology platform with 3 metal layers (Cu RDL) build-up. In this case, a low-temperature cure, negative-tone polyimide (PI) material is selected as the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4580b9054bd041c6e20f9d2d5af2a311
https://doi.org/10.1109/ectc.2017.315
https://doi.org/10.1109/ectc.2017.315