Zobrazeno 1 - 10
of 88
pro vyhledávání: '"Gila E. Stein"'
Publikováno v:
Langmuir. 39:7201-7211
Autor:
Dongjoo Lee, Nilesh Charpota, Hao Mei, Tanguy Terlier, Danica Pietrzak, Gila E. Stein, Rafael Verduzco
Publikováno v:
Macromolecules. 55:8909-8917
Publikováno v:
The Journal of Physical Chemistry B. 126:6562-6574
Polymeric chemically amplified resists (CARs) are critical materials for high-throughput lithographic processes. A photoactivated acid-anion catalyst changes the polymer's solubility via a deprotection reaction, which enables pattern development thro
Publikováno v:
Advances in Patterning Materials and Processes XL.
Publikováno v:
ACS Polymers Au.
Publikováno v:
Macromolecules. 54:1912-1925
The acid-catalyzed deprotection of glassy polymer resins is an important process in semiconductor lithography. Studies have shown that the reaction kinetics in these materials is controlled by slow...
Publikováno v:
Polymer Chemistry. 12:5831-5841
Unfunctionalized vinyl-addition polynorbornene (VAPNB) possesses many outstanding properties such as high thermal, chemical, and oxidative stability. These features make VAPNB a promising candidate for many engineering applications. However, VAPNB ha
Autor:
Yilin Li, Gila E. Stein, Tanguy Terlier, Zhiqi Hu, Adeline Huizhen Mah, Rafael Verduzco, Hao Mei
Publikováno v:
ACS macro letters. 9(8)
Bottlebrush polymers can be used to introduce novel surface properties including hydrophilicity, stimuli-responsiveness, and reduced friction forces. However, simple, general, and efficient approaches to cross-linking bottlebrush polymer films and co
Autor:
Dayton P. Street, Gila E. Stein, Thomas Kinsey, S. Michael Kilbey, Jonathan P. Coote, Joshua Sangoro
Publikováno v:
ACS macro letters. 9(4)
Lamellar block copolymers based on polymeric ionic liquids (PILs) show promise as electrolytes in electrochemical devices. However, these systems often display structural anisotropy that depresses the through-film ionic conductivity. This work hypoth
Publikováno v:
Advances in Patterning Materials and Processes XXXIX.