Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Gil Ho Hwang"'
Autor:
Jae Woong Choi, Ramana Murthy, Gil Ho Hwang, Steven Lee Hou Jang, Soon Wook Kim, Hongyu Li, Eugene Tan Swee Kiat, Lee Guan Ong
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:1820-1825
In this paper, we developed an isotropic wet etching process in a capsule-type bevel etch chamber to reduce a Cu overburden of through Si via (TSV) for less wafer-level warpage with 300 mm wafers. We report the relationship between the wafer-level wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06187fa08fa4ad8619d3bf76db12ac3e
https://doi.org/10.1109/tcpmt.2013.2279265
https://doi.org/10.1109/tcpmt.2013.2279265
Publikováno v:
Surface and Coatings Technology. 205:2714-2723
The effect of ultrasonic nanocrystal surface modification (UNSM) on Pt-modified aluminide coatings on Ni-based superalloy was investigated. UNSM was applied to make the grain size finer and to release compressive stress on the Al oxide film by reduci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed9eca8d46fd17e9350136653e6b22d2
https://doi.org/10.1016/j.surfcoat.2010.09.039
https://doi.org/10.1016/j.surfcoat.2010.09.039
Autor:
K.S. Park, Sung-Goon Kang, Chong Seung Yoon, Jae Hong Kim, Won-Kyu Han, Hyeun Hwan An, Gil-Ho Hwang, Seok-Jun Hong, M.J. Lee, G. Hong
Publikováno v:
Materials Chemistry and Physics. 123:401-406
In order to completely fill a 41 nm trench pattern with Cu using electroless deposition (ELD), we introduced a method of forming Au catalytic layer based on a self-assembled monolayer (SAM) of aminopropyltriethoxy silane molecules as a coupling agent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cfd7dcbb7d68d21415a00b382de96e9
https://doi.org/10.1016/j.matchemphys.2010.04.029
https://doi.org/10.1016/j.matchemphys.2010.04.029
Publikováno v:
Intermetallics. 18:864-870
The effect of Zr addition to Pt-modified aluminide coatings was investigated. Zr coatings on Pt-modified aluminide coatings were deposited by EB-PVD and heat treatments were conducted. SEM analysis indicated that Zr was situated at the surface and gr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3160fb0cd3164dfbfa4dca30f35931c5
https://doi.org/10.1016/j.intermet.2009.12.012
https://doi.org/10.1016/j.intermet.2009.12.012
Autor:
G. Hong, Sukjoon Hong, K.S. Park, Haoqun An, S.G. Kang, Jae Hong Kim, Gil-Ho Hwang, Chong Seung Yoon, M.J. Lee, Won-Kyu Han
Publikováno v:
Applied Surface Science. 256:2649-2653
To overcome the limitation of the sputtered Cu seed layer in electroplating of Cu interconnects imposed by the shadow effect, a new method for depositing a Cu seed layer on a 41 nm trench pattern based on combination of electroless plating (ELP) and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0647a032eea9e0548165b707664d46ef
https://doi.org/10.1016/j.apsusc.2009.11.012
https://doi.org/10.1016/j.apsusc.2009.11.012
Publikováno v:
Surface and Coatings Technology. 203:3066-3071
Pt-modified aluminide coatings were prepared with varying thicknesses of deposited Pt on the CM247LC substrate by heat treatment and a single step, high-activity pack aluminizing process. Following the heat treatment, the thickness of the interdiffus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b70b3f45544626ba5b0d2e52ff7586c4
https://doi.org/10.1016/j.surfcoat.2009.03.032
https://doi.org/10.1016/j.surfcoat.2009.03.032
Publikováno v:
Intermetallics. 17:381-386
Pt-, Pd-, and Pt/Pd-modified aluminide coatings were prepared on Inconel 738LC by pack aluminizing at 1034 °C. During pack aluminizing, Pt-modified aluminide coating formed a two-phase β-NiAl + PtAl 2 layer and a β-NiAl layer on an interdiffusion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e09c6b2ac499a725fcf46c987d99919
https://doi.org/10.1016/j.intermet.2008.08.014
https://doi.org/10.1016/j.intermet.2008.08.014
Autor:
Joon-Shik Park, Jin-Ki Cho, C.S. Yoon, Gil-Ho Hwang, Sung-Goon Kang, Seok-Jun Hong, Won-Kyu Han
Publikováno v:
Applied Surface Science. 255:6082-6086
Continuous electroless deposition of a 10-nm thick layer of Cu was successfully performed on a SiO2/Si substrate coated with a 3-nm Au catalytic layer. The Au catalytic layer was formed by a self-assembled monolayer (SAM) process terminated with NH2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6648b55f91a85af5af1a1211813843f7
https://doi.org/10.1016/j.apsusc.2009.01.037
https://doi.org/10.1016/j.apsusc.2009.01.037
Publikováno v:
Journal of the Korean Physical Society. 54:1191-1197
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f3123e5e07bdd5a1b720543a52a728d
https://doi.org/10.3938/jkps.54.1191
https://doi.org/10.3938/jkps.54.1191
Autor:
Seung-Jin Yeom, Gil-Ho Hwang, Seok-Jun Hong, Sung-Goon Kang, C.S. Yoon, Jae Hong Kim, Noh-Jung Kwak, Won-Kyu Han, Soo-Seok Kim
Publikováno v:
Microelectronic Engineering. 86:374-378
We have developed a novel activation technique for the conformal electroless deposition (ELD) of Cu on a SiO"2 substrate modified with an organic self-assembled monolayer. The SiO"2 substrate was modified with amine groups using 3-aminopropyltriethox
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccea3945319d3a29d790ab29168e25f0
https://doi.org/10.1016/j.mee.2008.11.024
https://doi.org/10.1016/j.mee.2008.11.024