Zobrazeno 1 - 10
of 153
pro vyhledávání: '"Gieser, H."'
Publikováno v:
In Microelectronics Reliability 2006 46(9):1629-1633
Autor:
Etherton, M., Qu, N., Willemen, J., Wilkening, W., Mettler, S., Dissegna, M., Stella, R., Zullino, L., Andreini, A., Gieser, H., Wolf, H., Fichtner, W.
Publikováno v:
In Microelectronics Reliability 2006 46(5):666-676
Autor:
Stadler, W., Esmark, K., Reynders, K., Zubeidat, M., Graf, M., Wilkening, W., Willemen, J., Qu, N., Mettler, S., Etherton, M., Nuernbergk, D., Wolf, H., Gieser, H., Soppa, W., De Heyn, V., Natarajan, M., Groeseneken, G., Morena, E., Stella, R., Andreini, A., Litzenberger, M., Pogany, D., Gornik, E., Foss, C., Konrad, A., Frank, M.
Publikováno v:
In Microelectronics Reliability 2005 45(2):269-277
Autor:
Bargstädt-Franke, S., Stadler, W., Esmark, K., Streibl, M., Domanski, K., Gieser, H., Wolf, H., Bala, W.
Publikováno v:
In Microelectronics Reliability 2005 45(2):297-304
Autor:
Willemen, J. *, Andreini, A., De Heyn, V., Esmark, K., Etherton, M., Gieser, H., Groeseneken, G., Mettler, S., Morena, E., Qu, N., Soppa, W., Stadler, W., Stella, R., Wilkening, W., Wolf, H., Zullino, L.
Publikováno v:
In Journal of Electrostatics 2004 62(2):133-153
Autor:
Bychikhin, S. *, Dubec, V., Litzenberger, M., Pogany, D., Gornik, E., Groos, G., Esmark, K., Stecher, M., Stadler, W., Gieser, H., Wolf, H.
Publikováno v:
In Journal of Electrostatics 2003 59(3):241-255
Autor:
Chaine, M *, Verhaege, K, Avery, L, Kelly, M, Gieser, H, Bock, K, Henry, L.G, Meuse, T, Brodbeck, T, Barth, J
Publikováno v:
In Microelectronics Reliability 1999 39(11):1531-1540
The method of the capacitive coupled transmission line pulsing (CC-TLP) is applied to a product IC at package level and for the first time at wafer level. The investigated product showed a field failure which could be reproduced by the CDM. The appli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::caa00e570a1632fd759ac66183382660
https://publica.fraunhofer.de/handle/publica/220929
https://publica.fraunhofer.de/handle/publica/220929
Autor:
Landesberger, C., Palavesam, N., Hell, W., Drost, A., Faul, R., Gieser, H., Bonfert, D., Bock, K., Kutter, C.
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP); 2016, p473-478, 6p