Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Gi-Tae Lim"'
Autor:
Young-Bae Park, Gi-Tae Lim
Publikováno v:
Current Applied Physics. 11:S115-S118
An observation of electromigration behavior in a eutectic SnPb solder with various line lengths was performed using an in-situ scanning electron microscope chamber with a 100 °C, 3 × 10 4 A/cm 2 condition. Edge-drift occurred at the cathode, and hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08ef680174653873d2b872f9aeca2aae
https://doi.org/10.1016/j.cap.2011.07.021
https://doi.org/10.1016/j.cap.2011.07.021
Autor:
Jaedong Kim, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo, Gi-Tae Lim, Kiwook Lee, Myeong-Hyeok Jeong
Publikováno v:
Journal of Electronic Materials. 39:2368-2374
Thermal annealing and electromigration (EM) tests were performed with Cu pillar/Sn bumps to understand the growth mechanism of intermetallic compounds (IMCs). Annealing tests were carried out at both 100°C and 150°C. At 150°C, EM tests were perfor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcad2d91b3636150c7c0c5c3c4c4027c
https://doi.org/10.1007/s11664-010-1345-7
https://doi.org/10.1007/s11664-010-1345-7
Autor:
Gi-Tae Lim, Byoung-Joon Kim, Young-Chang Joo, Jaedong Kim, Ho-Young Lee, Young-Bae Park, Kiwook Lee
Publikováno v:
Journal of Electronic Materials. 39:2281-2285
Fine-pitch Cu pillar bumps have been adopted for flip-chip bonding technology. Intermetallic compound (IMC) growth in Cu pillar bumps was investigated as a function of annealing or current stressing by in situ observation. The effect of IMC growth on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90ec24fded2c57e03ff52bda8498093e
https://doi.org/10.1007/s11664-010-1324-z
https://doi.org/10.1007/s11664-010-1324-z
Autor:
Kiwook Lee, Jaedong Kim, Ho-Young Lee, Byoung-Joon Kim, Young-Chang Joo, Young-Bae Park, Gi-Tae Lim
Publikováno v:
Metals and Materials International. 15:815-818
The reaction between Cu pillar and eutectic SnPb solder during isothermal annealing was studied systematically. Intermetallic compounds (IMCs), such as Cu6Sn5 and Cu3Sn, were formed in between Cu and SnThe parabolic rate law was observed on IMC forma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::879faf6dcaf337c8d4f8d502afe7d7fd
https://doi.org/10.1007/s12540-009-0815-4
https://doi.org/10.1007/s12540-009-0815-4
Publikováno v:
Metals and Materials International. 15:819-823
Intermetallic compounds (IMCs) and Kirkendall void growth kinetics at various interfaces in Au stud bumps were studied in terms of isothermal aging at 120 °C, 150 °C, and 180 °C for 300 h. Phases of AuSn, AuSn2, and AuSn4 form at the interface of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0ade199bd6a4bea5dbaf487f9ce8302
https://doi.org/10.1007/s12540-009-0819-0
https://doi.org/10.1007/s12540-009-0819-0
Publikováno v:
Journal of Electronic Materials. 38:2228-2233
The in situ intermetallic compound (IMC) growth in Cu pillar/Sn bumps was investigated by isothermal annealing at 120°C, 150°C, and 180°C using an in situ scanning electron microscope. Only the Cu6Sn5 phase formed at the interface between the Cu p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::188f04e19cb4f36e1dd4ac845344cee6
https://doi.org/10.1007/s11664-009-0922-0
https://doi.org/10.1007/s11664-009-0922-0
Autor:
Qwan-Ho Chung, Kwang-Yoo Byun, Young-Bae Park, Seung-Taek Yang, Gi-Tae Lim, Jang-Hee Lee, Min Suk Suh
Publikováno v:
Journal of the Korean Physical Society. 54:1784-1792
The e ects of severe current crowding and Joule heating on the damage morphology and the electromigration parameters were evaluated for ip chip Sn-3.5Ag solder bumps with Cu underbump metallurgy. in-situ electromigration testing in a scanning electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2085b96f60e8bad24abd60ce970452dd
https://doi.org/10.3938/jkps.54.1784
https://doi.org/10.3938/jkps.54.1784
Publikováno v:
2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Cu pillar bumps with eutectic SnPb solder were annealed and their microstructures were investigated. Linear relationship was observed between thickness of intermetallic compounds (IMCs: Cu6Sn5, Cu3Sn) and square root of time at 120 and 150degC. Kirke
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d40bca4010028596562041ea7f996eed
https://doi.org/10.1109/ipfa.2008.4588166
https://doi.org/10.1109/ipfa.2008.4588166
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Cu pillar bump with eutectic SnPb was annealed and the micro structures were observed by scanning electron microscopy. Both of Cu6Sn5 and Cu3Sn grew following parabolic rate law at 120 and 150degC. At 165degC, Cu6Sn5 growth was stagnated while Cu3Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71d3f64ee87512e66f51cf4975d3bebd
https://doi.org/10.1109/ectc.2008.4549992
https://doi.org/10.1109/ectc.2008.4549992
Autor:
Seung-Taek Yang, Young-Bae Park, Jang-Hee Lee, Qwan-Ho Chung, Gi-Tae Lim, Kwang-Yoo Byun, Min Suk Suh
Publikováno v:
2008 58th Electronic Components and Technology Conference.
To understand for size effect on electromigration behavior in flip chip Pb-free solder bump, electromigration tests were performed with change of pad open size and solder bump height at 140degC, 4.6times104 A/cm2. Electromigration lifetime increases
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dddb24057bb437b2d0e3d0a287b7ea20
https://doi.org/10.1109/ectc.2008.4550263
https://doi.org/10.1109/ectc.2008.4550263