Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Geun Sik Ahn"'
Autor:
Seok Hwan Moon, Jiho Joo, Geun-Sik Ahn, Yong-Sung Eom, Kim Ju Hyeon, Gil-Sang Yoon, Kwang-Joo Lee, Chul-Hee Lee, Kwang-Hee Lee, Jung Hak Kim, Kwang-Seong Choi, Moo-Sup Shim, leeseul Jeong
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A LABC (Laser-Assisted Bonding with Compression) bonder and NCF (Non-Conductive Film) were developed to increase the productivity of the bonding process for the advanced microelectronic packaging technology. The design features of a LABC make its UPH
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3d361c203a7cfa98178b42f92ac8da3
https://doi.org/10.1109/ectc.2019.00037
https://doi.org/10.1109/ectc.2019.00037
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 26:46-53
The joint structure of a transducer horn-holder assembly for a wire bonder was examined through finite element contact analysis. Three-dimensional modeling and analysis was carried out to survey the internal physics of this structure and to verify th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bc01ec44c19d6634599e3f139ad8b34
https://doi.org/10.1109/tepm.2003.812999
https://doi.org/10.1109/tepm.2003.812999
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers A. 26:2008-2017
Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab12bbb4b9e55bda842a9053c38d76e3
https://doi.org/10.3795/ksme-a.2002.26.10.2008
https://doi.org/10.3795/ksme-a.2002.26.10.2008
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing; Jan2003, Vol. 26 Issue 1, p46-53, 8p