Zobrazeno 1 - 10
of 76
pro vyhledávání: '"Germain Fenger"'
Autor:
Ling Ee Tan, Chih-I Wei, Lianghoon Yin, Azat M. Latypov, Shuling Wang, Satya Sriram, Prakash Deep, Farruh Shahidi, Shumay Shang, Germain Fenger, Le Hong, Werner Gillijns
Publikováno v:
Optical and EUV Nanolithography XXXVI.
Publikováno v:
Optical and EUV Nanolithography XXXVI.
Autor:
Werner Gillijns, Jae-Uk Lee, Ryan Ryoung han Kim, Chih-I Wei, Xima Zhang, Azat Latypov, Germain Fenger, John Sturtevant
Publikováno v:
Optical and EUV Nanolithography XXXVI.
Autor:
Ana-Maria Armeanu, Evgeny Malankin, Neal Lafferty, Chih-I Wei, Monica Sears, Germain Fenger, Xima Zhang, Werner Gillijns, Darko Trivkovic, Ryan Ryoung-Han Kim, Jeonghoon Lee
Publikováno v:
DTCO and Computational Patterning II.
Autor:
Jeonghoon Lee, Sandip Halder, Van Tuong Pham, Roberto Fallica, Seonggil Heo, Kaushik Sah, Hyo Seon Suh, Victor Blanco, Werner Gillijns, Andrew Cross, Ethan Maguire, Ana-Maria Armeanu, Vladislav Liubich, Evgeny Malankin, Xima Zhang, Monica Kempsell Sears, Neal Lafferty, Germain Fenger, Chih-I Wei, Ryoung Han Kim
Publikováno v:
DTCO and Computational Patterning II.
Single mask solution to pattern BLP and SNLP using 0.33NA EUV for next-generation DRAM manufacturing
Autor:
Kaushik Sah, Andrew Cross, Sayantan Das, Roberto Fallica, Jeonghoon Lee, Ryan Ryoung Kim, Sandip Halder, Ethan Maguire, Ana-Maria Armeanu, Monica Sears, Neal Lafferty, Vlad Liubich, Chih-i Wei, Germain Fenger
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2022.
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2022.
Autor:
Kan Zhou, Qijian Wan, Ao Chen, Wenzhan Zhou, Chunshan Du, Recoo Zhang, Yu Zhang, Wenming Wu, Germain Fenger, Seshadri Rampoori
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).
Autor:
Zhen-Fei Zheng, Wei Zhang, Chen-Wei Sun, Xiao Yang, Xiao-Mei Li, Feng Shao, Cynthia Zhu, Germain Fenger, Yue-Long Yu, Ying-Fang Wang
Publikováno v:
2022 International Workshop on Advanced Patterning Solutions (IWAPS).