Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Gerhard Podhradsky"'
Autor:
Dionysios Manessis, Tobias Kupka, Gerhard Podhradsky, Rainer Pamminger, Jakub Pawlikowski, Nils F. Nissen, Martin Schneider-Ramelow, Karsten Schischke, Thomas Krivec, Klaus-Dieter Lang, Sebastian Glaser
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Embedding technologies for heterogeneous integration of active and passive components are a promising approach for functional modules on the printed circuit board level. Modularity and embedding related miniaturization are key enablers for some upcom
Autor:
T. Krivec, Martin Schneider-Ramelow, Rolf Aschenbrenner, A. Ostmann, Karsten Schischke, G. Schulz, Dionysios Manessis, Gerhard Podhradsky, J. Pawlikowski, K-D. Lang
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
The proposed work is performed in the frame of the EU project “sustainablySMART”, which has undertaken research activities on “Eco-innovative approaches for advanced printed circuit boards” with the aim to demonstrate that embedding technolog
Autor:
Wojciech Stęplewski, Gerhard Podhradsky, Roland Ambrosch, Aneta Arazna, Kamil Janeczek, Piotr Ciszewski, Janusz Sitek, Piotr Dawidowicz, Marek Koscielski
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
A positive trend towards circular economy in many domains has been observed. This approach is based on reuse, repair activities that would lead to new functional device or a retrofitting that would lead to a new product. The standard period of use of