Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Gerhard Haubner"'
Autor:
Maciej Wojnowski, Walter Hartner, J. Lodermeyer, Christian Geissler, Markus Fink, Martin Richard Niessner, Francesca Arcioni, Gerhard Haubner
Publikováno v:
Journal of Surface Mount Technology. 34:32-39
Embedded wafer level ball grid array (eWLB) or FO-WLP (Fan-out wafer-level packaging) is investigated as a package for MMICs (Monolithic Microwave Integrated Circuit) for automotive radar applications in the 77GHz range. Special focus is put on the t
Publikováno v:
Microelectronics Reliability. 64:699-704
RADAR technology as sensor for collision warning has been used in upper class vehicles for some years now. Assembling this electronic is highly sophisticated and therefore expensive. With new developments in SiGe-technology and semiconductor packagin
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
A DfR (Design for Reliability) approach which is systematically based on simulation, sensitivity analysis and experimental validation is applied for identifying, understanding and controlling the key factors which determine the solder joint reliabili