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Autor:
Martin Schneider-Ramelow, V. Bader, Gerd Jungmann, S. Voges, Jeremias Pauls, Karl-Friedrich Becker, Tanja Braun, Mathias Minkus, Hubert Wieser, K-D. Lang
Publikováno v:
International Symposium on Microelectronics. 2017:000182-000187
The constant drive of microelectronics towards ever higher degrees of integration leads to a wide variety of concepts to yield smallest packages with maximized functionality – while side by side packaging leads to thinnest packages a small footprin