Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Gerard McVicker"'
Autor:
Fanghao Yang, Pritish R. Parida, Mark D. Schultz, Michael A. Gaynes, Ozgur Ozsun, Gerard McVicker, Timothy J. Chainer
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The application of embedded radial expanding micro-channels with micro-pin fields for two phase cooling of semiconductor dies has been successfully demonstrated. Thermal data has shown effective two-phase cooling at power densities in excess of those
Autor:
Ozgur Ozsun, Gerard McVicker, Michael A. Gaynes, Timothy J. Chainer, Pritish R. Parida, Fanghao Yang, Mark D. Schultz, Thomas Brunschwiler, Arvind Sridhar
Publikováno v:
2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Pumped two-phase cooling utilizing an interconnect-compatible dielectric fluid is an enabling technology to fully optimize the benefits of the improved integration density possible with three-dimensional (3D) stacking, but is faced with significant d
Autor:
Pritish R. Parida, Ozgur Ozsun, Mark D. Schultz, Gerard McVicker, Timothy J. Chainer, Ute Drechsler, Michael A. Gaynes
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The effective use of embedded radial expanding micro-channels with micro-pin fields for two phase cooling of a microprocessor die has been demonstrated. In this first part of a two part paper, the integration of this approach into a functional high p
Autor:
Mark D. Schultz, Michael A. Gaynes, Alper Buyuktosunoglu, Pritish R. Parida, Ozgur Ozsun, Gerard McVicker, Timothy J. Chainer, Thomas Brunschwiler, Arvind Sridhar, Augusto Vega
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Chip embedded two phase evaporative cooling is an enabling technology to provide intra-chip cooling of high power chips and interlayer cooling for 3D chip stacks. Utilizing an interconnect-compatible dielectric fluid provides a cooling solution compa
Autor:
Michael A. Gaynes, Pritish R. Parida, Gerard McVicker, Timothy J. Chainer, Evan G. Colgan, Thomas Brunschwiler, Bing Dang, Mark D. Schultz, Fanghao Yang, John U. Knickerbocker, Arvind Sridhar
Publikováno v:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Interlayer cooling utilizing pumped two-phase flow of a chip-to-chip interconnect-compatible dielectric fluid is an enabling technology for future high power 3D (three-dimensional) chip stacks. Development of this approach requires high fidelity and
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 11:80-86
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these
Publikováno v:
International Symposium on Microelectronics. 2013:000467-000472
A Blade Server System (BSS) utilizes Voltage Regulator Modules (VRM), in the form of Quad Flat No-Lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these V
Autor:
Qianwen Chen, Robert J. Polastre, Evan G. Colgan, Fanghao Yang, Bing Dang, Mark D. Schultz, John U. Knickerbocker, Jae-Woong Nah, Cornelia K. Tsang, Michael A. Gaynes, Pritish R. Parida, Gerard McVicker, Timothy J. Chainer, Yang Liu
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper reports on the integration and packaging of embedded radial micro-channels for 3D chip cooling. A thermal demonstration vehicle (TDV) has been designed, fabricated and assembled. Radial micro-channels based on deep Si etching was integrate
Autor:
Bing Dang, Mark D. Schultz, Pritish R. Parida, Gerard McVicker, Timothy J. Chainer, Evan G. Colgan, Fanghao Yang
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal challenges in 3D ICs have driven the need for embedded chip cooling. In this paper, we measured the thermal performance of a two-phase system employing flow boiling in chip-embedded micro-channels utilizing the latent heat of vaporization of
Publikováno v:
International Symposium on Microelectronics. 2010:000440-000445
Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariabl