Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Gerald G. Advocate"'
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A set of experiments designed to understand the evolution of electromigration damage in Pb-free interconnects was conducted. It is found that the degree of EM damage is higher with increasing stress current and stress duration, and dependent on the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57292d24d7e9340ef1f42f8654bb95e4
https://doi.org/10.1109/ectc.2015.7159882
https://doi.org/10.1109/ectc.2015.7159882
Autor:
Donald W. Henderson, Karl J. Puttlitz, D.-Y. Shih, M.J. Griffin, Myung-Jin Yim, Keith E. Fogel, Sung K. Kang, D.E. King, Amit K. Sarkhel, Timothy A. Gosselin, J.J. Konrad, Gerald G. Advocate, Charles C. Goldsmith, Paul A. Lauro
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 25:155-161
Recently, the research and development activities for replacing Pb-containing solders with Pb-free solders have been intensified due to both competitive market pressures and environmental issues. As a result of these activities, a few promising candi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::148d2754397968d1a677e63d0390699c
https://doi.org/10.1109/tepm.2002.801165
https://doi.org/10.1109/tepm.2002.801165