Zobrazeno 1 - 10
of 210
pro vyhledávání: '"Gerald Beyer"'
Autor:
Soon-Aik Chew, Serena Iacovo, Ferenc Fordor, Sven Dewilde, Katia Devriendt, Joeri De Vos, Andy Miller, Gerald Beyer, Eric Beyne
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Autor:
Carine Gerets, Jaber Derakhshandeh, Ehsan Shafahian, Tom Cochet, Douglas Charles La Tulipe, Gerald Beyer, Andy Miller, Eric Beyne
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Jaber Derakhshandeh, Douglas Charles La Tulipe, Giovanni Capuz, Vladimir Cherman, Carine Gerets, Tom Cochet, Ehsan Shafahian, Inge De Preter, Geraldine Jamieson, Tomas Webers, Eric Beyne, Gerald Beyer, Andy Miller
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Jaber Derakhshandeh, Eric Beyne, Gerald Beyer, Giovanni Capuz, Vladimir Cherman, Inge De Preter, Carine Gerets, Ehsan Shafahian, Koen Kennes, Geraldine Jamieson, Tom Cochet, Tomas Webers, Bert Tobback, Geert Van der Plas, Douglas Charles La Tulipe, Alain Phommahaxay, Andy Miller
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Koen Kennes, Alain Phommahaxay, Alice Guerrero, Samuel Suhard, Pieter Bex, Steven Brems, Xiao Liu, Sebastian Tussing, Gerald Beyer, Eric Beyne
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Serena Iacovo, Erik Sleeckx, Gerald Beyer, Stefan De Gendt, Eric Beyne, Fumihiro Inoue, Fuya Nagano, Alain Phommahaxay
Publikováno v:
ECS Transactions. 98:21-31
Three-dimensional circuit integration in vertical stacking attracts significant attention as a promising technique to fabricate higher performance and multifunctional chips without current 2D scaling limitation. Generally, the 3D integration using mi
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).
Autor:
Dennis Bumueller, Eric Beyne, Sebastian Tussing, Alice Guerrero, Xiao Liu, Gerald Beyer, Samuel Suhard, Pieter Bex, Alain Phommahaxay, Koen Kennes
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Laser debonding is assessed as an alternative to mechanical peel debonding in a collective hybrid bonding flow. Potential risks associated with the laser, such as the UV-photon energy, thermal energy and mechanical/acoustic energy are evaluated both
Autor:
Ehsan Shafahian, Carine Gerets, Eric Beyne, Masataka Maehara, Vladimir Cherman, G. Jamieson, Pieter Bex, Jaber Derakhshandeh, Inge De Preter, Julien Bertheau, Andy Miller, Fumihiro Inoue, T. Webers, Melina Lofrano, Tom Cochet, Lin Hou, Giovanni Capuz, Geert Van der Plas, Gerald Beyer, Douglas Charles La Tulipe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to $10 \mu \mathrm{m}$ . The impact of Co plating chemistry, Sn thickness, annealing temperat