Zobrazeno 1 - 9
of 9
pro vyhledávání: '"George J. Scott"'
Autor:
KiYeul Yang, Nathan Whitchurch, Michael G. Kelly, Curtis Zwenger, George J. Scott, TaeKyeong Hwang, WonMyoung Ki, JongHyun Jeon, JaeHun Bae
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f8fc9cf35c1f1a5a48418753c05f7ca
https://doi.org/10.1109/ectc32862.2020.00145
https://doi.org/10.1109/ectc32862.2020.00145
Publikováno v:
The Journal of the American Osteopathic Association. 118(5)
Hepatitis C virus (HCV) infection poses significant adverse health effects. Improper use of vials, needles, syringes, intravenous bags, tubing, and connectors for injections and infusions is a current preventable cause of iatrogenic HCV transmission.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::80193cdba4e79d1d1812c2f327138a0f
https://pubmed.ncbi.nlm.nih.gov/29710353
https://pubmed.ncbi.nlm.nih.gov/29710353
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000217-000247
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::362cfcf292f221e106d76bcaa73e160e
https://doi.org/10.4071/2015dpc-ta22
https://doi.org/10.4071/2015dpc-ta22
Autor:
Curtis Zwenger, JiHun Yi, WonChul Do, Bora Baloglu, Michael G. Kelly, Wongeol Lee, George J. Scott
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3fe9982e99c8689cf4ae2362091a2f6
https://doi.org/10.1109/ectc.2017.321
https://doi.org/10.1109/ectc.2017.321
Autor:
George J. Scott
Publikováno v:
Osteopathic Family Physician. 5:73-78
This paper proposes to introduce a method of performing the diabetic foot examination through introduction of a modified version of the cardinal techniques of examination (inspection, palpation, peripheral vascular or neurologic assessment, and auscu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::826044942c98f7af8b1ac1f46eeb56d3
https://doi.org/10.1016/j.osfp.2012.08.002
https://doi.org/10.1016/j.osfp.2012.08.002
Autor:
Yun Zhang, Joe Abys, Ken Takahashi, Christopher Parks, Charles C. Goldsmith, Chen Wang, Charles L. Arvin, George J. Scott
Publikováno v:
ECS Transactions. 35:15-26
Semiconductor packaging technology requires understanding how the fundamental materials properties of different structures interact to impact the final reliability of the system, how to measure those properties and how to control them. We investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06149bd07768436cc28fe4b8a02adb2a
https://doi.org/10.1149/1.3649926
https://doi.org/10.1149/1.3649926
Autor:
Tunga Krishna R, Gary LaFontant, Timothy D. Sullivan, E. Misra, Thomas A. Wassick, Timothy H. Daubenspeck, David L. Questad, George J. Scott, G. Osborne
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Two key C4 reliability concerns for the current and next generation integrated circuits are electromigration (EM) and “white C4” bumps caused by the stresses induced by die-package interactions. This paper discusses novel design and integration c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98d62ff2bc2329b9bc35e48d419f9963
https://doi.org/10.1109/ectc.2012.6248887
https://doi.org/10.1109/ectc.2012.6248887
Autor:
Arnold H, Rosenheck, George J, Scott, H Timothy, Dombrowski, Harold V, Cohen, Jill A, York, Alan, Kleiman, Joshua S, Coren
Publikováno v:
The Journal of the American Osteopathic Association. 112(2)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::27510882c8558df3be21bcd536f4f245
https://pubmed.ncbi.nlm.nih.gov/22331801
https://pubmed.ncbi.nlm.nih.gov/22331801
Autor:
Marco Baggiolini, Ian Clark-Lewis, R. Aebersold, Alfred Walz, George J. Scott, Bernhard Moser
Publikováno v:
Biochemistry. 30:3128-3135
Two recently identified pro-inflammatory proteins, namely, neutrophil activating peptide 1 (NAP-1) [also termed interleukin-8 (IL-8)] and NAP-2, were chemically synthesized, purified, and characterized. The fully protected NAP-1/IL-8 (72 residues) an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c563d426fc5267cf473df316bc3965a
https://doi.org/10.1021/bi00226a021
https://doi.org/10.1021/bi00226a021