Zobrazeno 1 - 10
of 10
pro vyhledávání: '"George H. Thiel"'
Publikováno v:
Circuit World. 48:425-433
Purpose The purpose of this paper is to describe a novel methodology for predicting reliability for consumer electronics or any other hardware systems that experience a complex lifecycle environmental profile. Design/methodology/approach This Physics
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bec95994890ed337530ec3b4dcfc64cd
https://doi.org/10.1108/cw-08-2020-0195
https://doi.org/10.1108/cw-08-2020-0195
Autor:
Flavio Griggio, Archit Shah, George H. Thiel, David B. Tuckerman, John A. Sellers, Bhargav Yelamanchili, Sherman E. Peek, Emma R. Schmidgall, Michael C. Hamilton, Vaibhav Gupta, Samuel d'Hollosy
Publikováno v:
IRPS
We present reliability characterization of a polyimide/copper-based flexible interconnect designed for cryogenic and quantum computing applications. This interconnect design uses commercial fabrication processes and off-the-shelf parts. Experiments w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb0821f731e9a958026514d7b976b8d4
https://doi.org/10.1109/irps46558.2021.9405090
https://doi.org/10.1109/irps46558.2021.9405090
Autor:
George H. Thiel, Flavio Griggio
Publikováno v:
IRPS
This paper describes a novel approach for predicting failure rates for components and hardware systems. A physics-of-failure-based methodology is provided to predict the degradation rate of a population using a Monte Carlo approach. The methodology r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8869105c2aa4a68fdbf68d2dc548179
https://doi.org/10.1109/irps.2019.8720495
https://doi.org/10.1109/irps.2019.8720495
Publikováno v:
Journal of Electronic Packaging. 139
Display light guides, commonly constructed of a polymer such as polymethyl methacrylate (PMMA), are known to be susceptible to moisture absorption, swelling, and warping in the field when exposed to elevated ambient humidity levels. This work present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64ad31e9ac2dfed4c3b17fb655bf37d8
https://doi.org/10.1115/1.4037971
https://doi.org/10.1115/1.4037971
Autor:
Pekka Turpeinen, L.P. Lehman, Mattt A. Korhonen, Karl J. Puttlitz, Brian Bowman, Donald W. Henderson, George H. Thiel, Raymond C. Parkes, Tia-Marje K. Korhonen
Publikováno v:
Journal of Electronic Materials. 33:1581-1588
The deformation properties of near-eutectic Sn-Ag-Cu alloy were measured in temperatures ranging from −25 to 125°C, and down to strain rates of about 10×10−9. Results have been combined into a stress versus strain rate master curve. The measure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e445ec529bd7db4cbc21200cd86d90c4
https://doi.org/10.1007/s11664-004-0101-2
https://doi.org/10.1007/s11664-004-0101-2
Autor:
George H. Thiel, Robert E. Miller
Publikováno v:
Composite Structures. 28:405-432
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::021b11e4eab612e4af8f9372229b8cf2
https://doi.org/10.1016/0263-8223(94)90122-8
https://doi.org/10.1016/0263-8223(94)90122-8
Autor:
Robert E. Miller, George H. Thiel
Publikováno v:
Composite Structures. 27:339-355
A new finite element for modeling axiysymmetric circular plates is developed. The element is based upon Mindlin's shear-deformable plate theory, and elements may be stacked on top of one another to model laminated plate by the addition of only rotati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f795414570aa381210e8c231277a8e60
https://doi.org/10.1016/0263-8223(94)90261-5
https://doi.org/10.1016/0263-8223(94)90261-5
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Conference
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