Zobrazeno 1 - 3
of 3
pro vyhledávání: '"George F. Raiser"'
Publikováno v:
MEMS and Nanotechnology, Volume 5 ISBN: 9783319007793
Digital image correlation is an attractive displacement measurement method for thermo-mechanical characterization and simulation of electronic assemblies, but faces a number of challenges to implementation. In this paper, a batch reflow oven with a l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::817baf1bf52347f2aa01d96ee1f1c7cf
https://doi.org/10.1007/978-3-319-00780-9_1
https://doi.org/10.1007/978-3-319-00780-9_1
Autor:
George F. Raiser, Dudi Amir
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
The various methods for improvement of package solder joint reliability (SJR) have centered on the broad categories of (i) reductions in the thermomechanical and mechanical stresses and strains applied to the joints, and (ii) strengthening of the sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a138c817d877eb934567d950e5b82185
https://doi.org/10.1115/ipack2005-73045
https://doi.org/10.1115/ipack2005-73045
Autor:
Paul Zimmerman, Rajen Dias, Mike Mello, Lars D. Skoglund, George F. Raiser, Vasudeva Atluri, Robert Hernandez, Vijay Gupta
Publikováno v:
International Symposium for Testing and Failure Analysis.
A laser spallation technique to measure the tensile strength of thin film interfaces is introduced. In this technique, a laser-generated stress wave of nanosecond duration in the substrate spalls off (completely removes) a coating deposited on the su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a70f470c69402e66ace0baaa7c5d5368
https://doi.org/10.31399/asm.cp.istfa2000p0025
https://doi.org/10.31399/asm.cp.istfa2000p0025