Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Georg ALLIKAS"'
Autor:
Henrik HERRANEN, Ott PABUT, Martin EERME, Jüri MAJAK, Meelis POHLAK, Jaan KERS, Mart SAARNA, Georg ALLIKAS, Aare ARUNIIT
Publikováno v:
Medžiagotyra, Vol 18, Iss 1, Pp 45-50 (2012)
The purpose of this study was to design a light-weight sandwich panel for trailers. Strength calculations and selection of different materials were carried out in order to find a new solution for this specific application. The sandwich materials were
Externí odkaz:
https://doaj.org/article/8fcc13f995144036af44fa17eb4c9700
Autor:
Georg Allikas, Henri Lend, Hendrik Herranen, Jüri Majak, Jurgo Preden, Jaan Kers, Robert Talalaev, Martin Eerme
Publikováno v:
Advanced Materials Research. 905:239-243
A complex electronics circuit placeholder is embedded in the carbon fiber laminate. The reduction of the material mechanical strength is assessed. The strain interaction between electronics and carbon fiber laminate is measured with digital image cor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::181e1b1c65301acc6d26739fa433d2ee
https://doi.org/10.4028/www.scientific.net/amr.905.239
https://doi.org/10.4028/www.scientific.net/amr.905.239
Autor:
M. Pohlak, Jüri Majak, Aare Aruniit, Ott Pabut, Jaan Kers, Georg Allikas, Martin Eerme, Henrik Herranen, Mart Saarna
Publikováno v:
Medžiagotyra, Vol 18, Iss 1, Pp 45-50 (2012)
The purpose of this study was to design a light-weight sandwich panel for trailers. Strength calculations and selection of different materials were carried out in order to find a new solution for this specific application. The sandwich materials were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a68352fe571583a42827fd263e8f559b
https://doi.org/10.5755/j01.ms.18.1.1340
https://doi.org/10.5755/j01.ms.18.1.1340
Autor:
Tauno Otto, Georg Allikas, Karl Mädamürk, Karl Vene, Henrik Herranen, Maarjus Kirs, Martin Eerme, Andre Gregor
Publikováno v:
Estonian Journal of Engineering. 18:279
The paper addresses the issue of embedding the rectangular printed circuit board (PCB) - the placeholder for a complex sensor system circuit - in the glass fibre laminate during the lamination. The change of the material mechanical properties due to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2372856d726cfb965b7b4978981ecb70
https://doi.org/10.3176/eng.2012.3.13
https://doi.org/10.3176/eng.2012.3.13