Zobrazeno 1 - 10
of 78
pro vyhledávání: '"Geoffrey Wilcox"'
Autor:
Geoffrey Wilcox, Terho Kutilainen, Caterina Soldano, Marko Pudas, Jussi Hokka, Jaan Praks, Mark Ashworth
Publikováno v:
CEAS Space Journal. 15:113-126
Funding Information: The majority of the work was financed by ESA project "Atomic Layer Deposition for Tin Whiskers Mitigation and Cure on Space Electronics Manufacturing" 4000122745/18/NL/LvH/gp. The authors also acknowledge use of facilities within
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ff4c686b3dbae0e0d54317cf20703688
https://doi.org/10.1007/s12567-021-00393-1
https://doi.org/10.1007/s12567-021-00393-1
Autor:
Terho Kutilainen, Liang Wu, Jing Wang, Marko Pudas, Tero Lehto, Jussi Hokka, Geoffrey Wilcox, Paul Collander, Mark Ashworth
Publikováno v:
Journal of Electronic Materials. 48:7573-7584
This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process va
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbbec9ec584a268d691a4fc85e759e5a
https://doi.org/10.1007/s11664-019-07534-7
https://doi.org/10.1007/s11664-019-07534-7
Publikováno v:
Transactions of the IMF. 97:129-139
There are very few studies that have investigated directly the effect of an oxide film on tin whisker growth, since the ‘cracked oxide theory’ was proposed by Tu in 1994. The current study has inve...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9ebd2414a1fe25b0a259014699374cf
https://doi.org/10.1080/00202967.2019.1587263
https://doi.org/10.1080/00202967.2019.1587263
Autor:
Geoffrey Wilcox, Clive Larson
Publikováno v:
Transactions of the IMF. 100:1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b6b98f1bcf48432c5d24e95fa9342cd
https://doi.org/10.1080/00202967.2021.2014671
https://doi.org/10.1080/00202967.2021.2014671
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Picosun is undertaking a research programme, funded by the European Space Agency, in collaboration with Oy Poltronic Ab and Loughborough University, to evaluate conformal coatings made with atomic layer deposition (ALD) as a method of mitigating the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::742c02c48ba4a3cfe7511091224f9237
https://doi.org/10.23919/empc44848.2019.8951757
https://doi.org/10.23919/empc44848.2019.8951757
Publikováno v:
Transactions of the IMF. 93:332-341
There are very few studies that have investigated directly the effect of an oxide film on tin whisker growth, since the ‘cracked oxide theory’ was proposed by Tu in 1994 [K.-N. Tu: Phys. Rev., 1994, 49, (3), 2030–2034]. The current study has in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d449266f74434b29b7afbc2280aca57
https://doi.org/10.1080/00202967.2015.1117258
https://doi.org/10.1080/00202967.2015.1117258
Publikováno v:
ECS Transactions. 66:1-9
Electroplated zinc finishes have been widely used in the packaging of electronic products for many years as a result of their excellent corrosion resistance and relatively low cost. However, the spontaneous formation of whiskers on zinc electroplated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9796ce2b9d66a96bcb84be80f0da5a68
https://doi.org/10.1149/06621.0001ecst
https://doi.org/10.1149/06621.0001ecst
Publikováno v:
ECS Transactions. 64:109-121
Electronics products are increasingly required to operate at high temperatures in harsh environments, for instance in oil well, geophysical drilling and aerospace applications. Conventional solder interconnects, that have been extensively utilised in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::108c19ea69ae2bb7c13a5965c64b6de9
https://doi.org/10.1149/06440.0109ecst
https://doi.org/10.1149/06440.0109ecst
Publikováno v:
Transactions of the IMF. 93:1-8
Electroplated zinc finishes have been associated with the electronics industry for many years as a result of their excellent corrosion resistance and relatively low cost. They are normally applied onto ferrous products to provide corrosion protection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9782084b7331f3e5ca3b8819afdc484
https://doi.org/10.1179/0020296715z.000000000227
https://doi.org/10.1179/0020296715z.000000000227
Publikováno v:
Journal of The Electrochemical Society. 162:D147-D153
The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies. This is primarily due to excessive intermetallic compounds (IMCs) that can form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b9a5761c8339aeeb8682b532a0fa87b
https://doi.org/10.1149/2.0331504jes
https://doi.org/10.1149/2.0331504jes