Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Gengxin Tian"'
Autor:
Liqiang Cao, Gengxin Tian
Publikováno v:
MicroSystem Based on SiP Technology ISBN: 9789811900822
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8308ace7edb3847cb4a24d8cce856a69
https://doi.org/10.1007/978-981-19-0083-9_28
https://doi.org/10.1007/978-981-19-0083-9_28
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1967-1978
In the current 4G Long Term Evolution and the incoming 5G mobile communication technology, as the number of radio frequency (RF) devices in the RF front-end module is increasing fast, miniaturization is essential and significant. The 3-D RF system-in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cbf263e591a96f0a91695c862292828
https://doi.org/10.1109/tcpmt.2018.2842084
https://doi.org/10.1109/tcpmt.2018.2842084
Publikováno v:
Microelectronics Reliability. 83:29-38
Warpage for 320 mm × 320 mm panel level fan-out packaging based on die-first process was investigated by both simulation and experimental approaches. In the present paper, a simple and efficient FEA (Finite Element Analysis) method based on shell el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f649396eb7b5292a2cb875ca690279e
https://doi.org/10.1016/j.microrel.2018.02.010
https://doi.org/10.1016/j.microrel.2018.02.010
Publikováno v:
Journal of Electronic Testing. 33:741-750
Near-field measurement, as an efficient method for studying the electromagnetic interference (EMI) problem, is becoming increasingly important. The calibration of the near-field probe is a critical part in the measurement procedure. This paper presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::938a0f4bf5e632828dd2680c19bea86d
https://doi.org/10.1007/s10836-017-5691-8
https://doi.org/10.1007/s10836-017-5691-8
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 58:442-447
With the continuous improvement of system integration, 3-D packages are becoming effective solutions for lighter, thinner, shorter, and smaller electronic products. Meanwhile, packaging engineers are faced with serious signal integrity challenges. Es
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c1fac7be1dd6835add73cacce6ec580
https://doi.org/10.1109/temc.2015.2503729
https://doi.org/10.1109/temc.2015.2503729
Publikováno v:
Microelectronics Journal. 49:43-48
The thin film integrated passive device (IPD) has caused intensively attention due to its high integrated level and application in System in Package (SiP). Meanwhile, the IPD filter has shown great application value in modern wireless communication s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33d76be2e733b2aa7a9311fedd98be0f
https://doi.org/10.1016/j.mejo.2015.12.012
https://doi.org/10.1016/j.mejo.2015.12.012
Publikováno v:
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Electromagnetic interference (EMI) has become a remarkable and negligible problem in SiP module. As package tend to higher density and smaller size, the electromagnetic environment become complex and severe. The shortening distance between different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fb3ab1f1048f7bd09fbf10f78149952
https://doi.org/10.1109/icept.2015.7236703
https://doi.org/10.1109/icept.2015.7236703