Zobrazeno 1 - 10
of 101
pro vyhledávání: '"Geert Van der Plas"'
Autor:
Georg Elsinger, Herman Oprins, Vladimir Cherman, Geert Van der Plas, Eric Beyne, Ingrid De Wolf
Publikováno v:
Fluids, Vol 9, Iss 3, p 69 (2024)
With ever increasing integration density of electronic components, the demand for cooling solutions capable of removing the heat generated by such systems grows along with it. It has been shown that a viable answer to this demand is the use of direct
Externí odkaz:
https://doaj.org/article/082e7d6f834146eb9a9b13c24dcf7e52
Autor:
Hesheng Lin, Geert van der Plas, Xiao Sun, Dimitrios Velenis, Francky Catthoor, Rudy Lauwereins, Eric Beyne
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30:1748-1756
ispartof: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS vol:30 issue:11 pages:1748-1756 status: published
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3e4f76e2d03a43ddaa3b4d76d25f7cb0
https://doi.org/10.1109/tvlsi.2022.3183904
https://doi.org/10.1109/tvlsi.2022.3183904
Autor:
Giuliano Sisto, Rongmei Chen, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Van der Plas, Julien Ryckaert
Publikováno v:
DTCO and Computational Patterning II.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bef11c6de898f6bae578fec1e5a338d3
https://doi.org/10.1117/12.2656469
https://doi.org/10.1117/12.2656469
Autor:
Hesheng Lin, Dimitrios Velenis, Philip Nolmans, Xiao Sun, Francky Catthoor, Rudy Lauwereins, Geert Van der Plas, Eric Beyne
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30:661-665
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b81142a6d3c31d28ab08a2c68ba8d11
https://doi.org/10.1109/tvlsi.2022.3149589
https://doi.org/10.1109/tvlsi.2022.3149589
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:401-409
In this work, we present the analytical model of buck converter with 3D in-package air-core inductor (150 μm thick). To optimize the power efficiency at a targeted power density, models including 3D inductor and power switches are developed. Compare
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c14c28b242db90dd1340f4de46fd321c
https://doi.org/10.1109/tcpmt.2021.3102435
https://doi.org/10.1109/tcpmt.2021.3102435
Autor:
Dries Bosman, Martijn Huynen, Daniel De Zutter, Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne, Dries Vande Ginste
Publikováno v:
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a novel strategy to handle the challenges associated with the evolution toward higher operating f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a0138ce095afb4c92cc815543d98364
https://hdl.handle.net/1854/LU-01GWH3AMZVDW5A6BB6BSWYCXVJ
https://hdl.handle.net/1854/LU-01GWH3AMZVDW5A6BB6BSWYCXVJ
Autor:
Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne
Publikováno v:
Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d53b59feb43853b2d76838e942a7eb27
https://doi.org/10.1145/3557988.3569716
https://doi.org/10.1145/3557988.3569716
Autor:
Vladimir Cherman, Geert Van der Plas, Bartlomiej Jan Pawlak, Eric Beyne, Luke England, Kathryn C. Rivera, Herman Oprins, Martine Baelmans, Tiwei Wei, Zhi Yang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:415-425
In this article, we design, demonstrate, and characterize a 3-D printed package-level polymer jet impingement cooling solution on a $23\times23$ mm2 thermal test chip. The experimental hardware results for a nozzle pitch of 2 mm show that, with 1-kW
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff62625689f7a102ce4c8685599e4858
https://doi.org/10.1109/tcpmt.2020.3045113
https://doi.org/10.1109/tcpmt.2020.3045113
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d791aebef0a10ed300c13793d0e33e0c
https://doi.org/10.1109/itherm54085.2022.9899603
https://doi.org/10.1109/itherm54085.2022.9899603