Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Gaurang N. Choksi"'
Autor:
Gregory M. Chrysler, Gaurang N. Choksi, Vasudeva Atluri, Chia-Pin Chiu, John Tang, Priyavadan R. Patel, Debendra Mallik, Ravi Mahajan, Ram S. Viswanath, Vijay S. Wakharkar
Publikováno v:
MRS Bulletin. 28:21-34
Historically, the primary function of microprocessor packaging has been to facilitate electrical connectivity of the complex and intricate silicon microprocessor chips to the printed circuit board while providing protection to the chips from the exte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99257b7b35e9a9b34903e807629e728e
https://doi.org/10.1557/mrs2003.14
https://doi.org/10.1557/mrs2003.14
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
Research and development on System in Package (SiP) technologies is prevalent now both in industry and academia. This paper provides an overview of SiP from a CPU and communications systems perspective. Some of the items that will be covered include
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6d5934d63c3fbde99441a6d708379ec
https://doi.org/10.1115/ipack2005-73320
https://doi.org/10.1115/ipack2005-73320