Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Gaudentiu Varzaru"'
Publikováno v:
Recent Progress in Science and Technology Vol. 8 ISBN: 9788119102747
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5757dc57034d9e8d924199265d0e6e9
https://doi.org/10.9734/bpi/rpst/v8/18843d
https://doi.org/10.9734/bpi/rpst/v8/18843d
Publikováno v:
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Autor:
Bogdan Mihailescu, Ciprian Ionescu, Daniel Comeaga, Gaudentiu Varzaru, Mihai Branzei, Florin Baciu
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Autor:
Gaudentiu Varzaru, Razvan Ungurelu, Mihai Branzei, Bogdan Mihailescu, Ciprian Ionescu, Paul Svasta
Publikováno v:
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Autor:
Razvan Ungurelu, Gaudentiu Varzaru, Simona Gheorghe, Marin Gheorghe, Mihai Branzei, Ciprian Ionescu, Bogdan Mihailescu, Paul Svasta
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
A study was conducted on increasing the current carrying capability of conductor tracks made of electrically conductive composite materials to know the limitations when used in the manufacture of electronic modules by additive techniques. Conductor t
Publikováno v:
2020 7th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE).
The paper presents some aspects of practical deployment of an Internet-of-Things network on a large agricultural area in South West of Romania. Data from sensors detecting soil and air parameters are gathered by local stations and must be available o
Autor:
Mihai Branzei, Bogdan Mihailescu, Gaudentiu Varzaru, Marin Gheorghe, Ciprian Ionescu, Paul Svasta, Razvan Ungurelu
Publikováno v:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents the investigation of composite structures made by overlapping two or more layers of resins, including conductive resins, at different time intervals, as well as different temperatures. This situation occurs in the case of a model o
Publikováno v:
2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents a solution to control the temperature and humidity in a greenhouse. A previous implementation was based on the exchange of air masses between the interior and exterior of the greenhouse. But it was difficult to obtain a lower and s
Publikováno v:
2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents the investigations of bonds mechanical and electrical properties function of electrically conductive paste printed volumes. For the experiments, it was taken into consideration the SW180 electrically conductive paste type which was
Publikováno v:
2019 11th International Conference on Electronics, Computers and Artificial Intelligence (ECAI).
The paper presents the results of the simultaneous determinations carried out on the same gaseous media, on the one hand with a sensor measuring CO 2 concentration, and on the other with a digital gas sensor which, based on intelligent algorithms, pr