Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Gary Menezes"'
Autor:
Vidya Jayaram, Scott McCann, Raj Pulugurtha, Vanessa Smet, Venky Sundaram, Urmi Ray, Rao Tummala, Bhupender Singh, Gary Menezes
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:726-733
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5- $\mu \text{m}$ lithographic design rules,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cbcb402fa80ac7c95c248ceb8f75d95
https://doi.org/10.1109/tcpmt.2017.2684464
https://doi.org/10.1109/tcpmt.2017.2684464
Autor:
Pulugurtha Markondeya Raj, Riko Radojcic, Bhupender Singh, Vanessa Smet, Brian Roggeman, Urmi Ray, Gary Menezes, Makoto Kobayashi, Venky Sundaram, Jae Sik Lee, Rao Tummala
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper reports the first demonstration of the drop-test reliability performance of large, ultra-thin glass BGA packages that are directly mounted onto the system board, unlike the current approach of flip-chip assembly of interposers, involving a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe979a748b4fd0ce56da0865925f453a
https://doi.org/10.1109/ectc.2015.7159806
https://doi.org/10.1109/ectc.2015.7159806
Autor:
Rao Tummala, Gary Menezes, Venky Sundaram, Makoto Kobayashi, Vanessa Smet, Pulugurtha Markondeya Raj
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
This paper reports the use of circumferential polymer collars as a strain-relief mechanism to improve the fatigue life of low-CTE package-to-PCB solder interconnections, while preserving SMT-compatibility and reworkability. Acting as a partial underf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8936f55bee45b5e4ff01aebbc72bc307
https://doi.org/10.1109/ectc.2014.6897571
https://doi.org/10.1109/ectc.2014.6897571