Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Gary Menezes"'
Autor:
Vidya Jayaram, Scott McCann, Raj Pulugurtha, Vanessa Smet, Venky Sundaram, Urmi Ray, Rao Tummala, Bhupender Singh, Gary Menezes
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:726-733
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5- $\mu \text{m}$ lithographic design rules,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cbcb402fa80ac7c95c248ceb8f75d95
https://doi.org/10.1109/tcpmt.2017.2684464
https://doi.org/10.1109/tcpmt.2017.2684464
Autor:
Pulugurtha Markondeya Raj, Riko Radojcic, Bhupender Singh, Vanessa Smet, Brian Roggeman, Urmi Ray, Gary Menezes, Makoto Kobayashi, Venky Sundaram, Jae Sik Lee, Rao Tummala
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper reports the first demonstration of the drop-test reliability performance of large, ultra-thin glass BGA packages that are directly mounted onto the system board, unlike the current approach of flip-chip assembly of interposers, involving a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe979a748b4fd0ce56da0865925f453a
https://doi.org/10.1109/ectc.2015.7159806
https://doi.org/10.1109/ectc.2015.7159806
Autor:
Rao Tummala, Gary Menezes, Venky Sundaram, Makoto Kobayashi, Vanessa Smet, Pulugurtha Markondeya Raj
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
This paper reports the use of circumferential polymer collars as a strain-relief mechanism to improve the fatigue life of low-CTE package-to-PCB solder interconnections, while preserving SMT-compatibility and reworkability. Acting as a partial underf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8936f55bee45b5e4ff01aebbc72bc307
https://doi.org/10.1109/ectc.2014.6897571
https://doi.org/10.1109/ectc.2014.6897571
Autor:
Singh, Bhupender, Menezes, Gary, McCann, Scott, Jayaram, Vidya, Sundaram, Venky, Pulugurtha, Raj, Smet, Vanessa, Tummala, Rao, Ray, Urmi
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; May2017, Vol. 7 Issue 5, p726-733, 8p
Autor:
Singh, Bhupender, Smet, Vanessa, Lee, Jaesik, Menezes, Gary, Kobayashi, Makoto, Raj, Pulugurtha Markondeya, Sundaram, Venky, Roggeman, Brian, Ray, Urmi, Radojcic, Riko, Tummala, Rao
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1566-1573, 8p
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1-36, 36p
Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars.
Autor:
Menezes, Gary, Smet, Vanessa, Kobayashi, Makoto, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1959-1964, 6p
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1-38, 38p