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pro vyhledávání: '"Gary H.G. Chan"'
Autor:
Gary H.G. Chan, W. F. Kho
Publikováno v:
International Symposium for Testing and Failure Analysis.
Contamination by particles is one of the major causes of failures in integrated circuits. In some cases, particles may absorb moisture leading to electrochemical migration, dendrite growth, and electrical leakage and short failures. This work present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6725c562395e4b91bf863c52b913ead
https://doi.org/10.31399/asm.cp.istfa2016p0613
https://doi.org/10.31399/asm.cp.istfa2016p0613
