Preface : Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting; Boston, MA; 1 December 2008 through 3 December 2008

Autor: Roozeboom, F., Bower, C.A., Garrou, P.E., Koyanagi, M., Ramm, P.

Publikováno v: Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A, XI-XII
STARTPAGE=XI;ENDPAGE=XII;TITLE=Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A

3-dimensional integration (3D IC) is a system level architecture/technology wherein multiple layers of planar devices are stacked and vertically interconnected through the silicon substrate (or other semiconductor material) in the Z direction as show

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https://research.tue.nl/nl/publications/eb571a86-b688-4b13-b8de-42686ac7c946

Cost Implications of Large Area MCM Processing.

Autor: Frye, D.C., Skinner, M.P., Heistand, R.H., Garrou, P.E., Tessier, T.G.

Publikováno v: Proceedings of the International Conference on Multichip Modules; 1994, p69-80, 12p

Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D.

Autor: Ida, Y., Garrou, P.E., Strandjord, A.J.G., Cummings, S.L., Boyd Rogers, W., Berry, M.J., Kisting, S.R.

Publikováno v: Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium; 1995, p441-444, 4p

One Mask Process For Stress-buffer And Passivation Applications Using Photosensitive Benzocyclobutene.

Autor: Strandjord, A.J.G., Rogers, W.B., Ida, Y., Shiau, S., Moyer, E.S., Scheck, D.M., DeVellis, R.R., Garrou, P.E.

Publikováno v: IEMT/IMC Symposium, 1st Joint International Electronic Manufacturing Symposium & the International Microelectronics Conference; 1997, p261-266, 6p

MCM-LD: large area processing using photosensitive-BCB.

Autor: Strandjord, A.J.G., Garrou, P.E., Heistand, R.H., Tessier, T.G.

Publikováno v: IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; 1995, Vol. 18 Issue 2, p269-276, 8p