Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Garrett Andrew Piech"'
Publikováno v:
International Symposium on Microelectronics. 2013:000625-000630
There is growing interest in applying glass as a substrate for 2.5D/3D applications. Glass has many material properties that make it well suited for interposer substrates. Glass based solutions provide significant opportunities for cost reduction by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a05e1b877a4c790e137a75f3da4f167
https://doi.org/10.4071/isom-2013-wp13
https://doi.org/10.4071/isom-2013-wp13
Autor:
James A. Ferwerda, Alicia Stillwell, James A. West, Howard Hovagimian, Ellen Marie Kosik Williams, Garrett Andrew Piech, Jacques Gollier, Shandon Dee Hart
Publikováno v:
SID Symposium Digest of Technical Papers. 44:295-297
A new method for quantifying “sparkle” uses a simple measurement which includes a pixelated source, a test sample, and an eye simulator. The degree of sparkle is calculated from the standard deviation of the pixel powers across a portion of the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e56ad8477aa425bbdadffa87a899ddee
https://doi.org/10.1002/j.2168-0159.2013.tb06204.x
https://doi.org/10.1002/j.2168-0159.2013.tb06204.x
Autor:
M.J. Soulliere, U. Neukirch, M. Anderegg, Dragan Pikula, Michael Brian Webb, Garrett Andrew Piech, D. Sobiski, R. Hoyt, Yihong Mauro, M. Hempstead, Michal Mlejnek, Michael J. Dailey, Feiling Wang, C. Drewnowski
Publikováno v:
Journal of Lightwave Technology. 22:1189-1200
Design, test, and performance requirement and analysis for a polarization-mode-dispersion compensator (PMDC) with four degrees of freedom is presented. The performance is analyzed on the basis of time-integrated and time-resolved bit-error ratio (BER
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::586344909424e97bab7c290217bd57ed
https://doi.org/10.1109/jlt.2004.825898
https://doi.org/10.1109/jlt.2004.825898
Autor:
Lili Tian, Prantik Mazumder, Karl W. Koch, Shandon Dee Hart, Domenico Tulli, Garrett Andrew Piech, Ruchirej Yongsunthon, Valerio Pruneri, Albert Carrilero
Publikováno v:
ACS applied materialsinterfaces. 6(14)
Hierarchical micro- and nanostructured surfaces have previously been made using a variety of materials and methods, including particle deposition, polymer molding, and the like. These surfaces have attracted a wide variety of interest for application
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a23086beb75e2d0b10bf01044e2360f
https://pubmed.ncbi.nlm.nih.gov/25927365
https://pubmed.ncbi.nlm.nih.gov/25927365
Autor:
Garrett Andrew Piech, Aric Shorey, John T. Keech, Satish C. Chaparala, Scott Pollard, Bor Kai Wang
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
There is growing interest in applying glass as a substrate for 2.5D/3D applications. Glass has many material properties that make it well suited for interposer substrates. Glass based solutions provide significant opportunities for cost benefits by l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2df754f46fafa6dcea97cccf3a7195b
https://doi.org/10.1109/eptc.2013.6745811
https://doi.org/10.1109/eptc.2013.6745811
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Over the past several years, the semiconductor industry has seen some tremendous developments in using glass as an interposer substrate. Glass has many properties that make it an ideal substrate for interposer substrates such as: ultra-high resistivi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4138dd9dbac81ac7a261c005dc9e8c42
https://doi.org/10.1109/ectc.2013.6575825
https://doi.org/10.1109/ectc.2013.6575825
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
Glass has many properties that make it an ideal substrate for important 3D-IC applications such as interposer substrates and glass carrier wafers. Critical material properties such as: ultra-high resistivity, low dielectric constant, ultra-low electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6dd2ff4f6967fe7441f925d15e2bd3f
https://doi.org/10.1109/asmc.2013.6552803
https://doi.org/10.1109/asmc.2013.6552803
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Through-substrate vias (TSV) are critical for Three-Dimensional Stacked Integrated Circuits (3DS-IC) integration. While silicon traditionally has been used in this application, glass has properties that make it a very intriguing material for through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c077e55414824e1849b37caeecbf7de5
https://doi.org/10.1109/ectc.2012.6248843
https://doi.org/10.1109/ectc.2012.6248843
Autor:
Gordon Charles Brown, Yabo Li, Chung-En Zah, Wayne Liu, Albert Heberle, Dmitri Vladislavovich Kuksenkov, Douglas Llewellyn Butler, Garrett Andrew Piech, Nick Visovsky, Jin Li, Dragan Pikula
Publikováno v:
SPIE Proceedings.
The wavelength tunable 1060-nm distributed Bragg reflector (DBR) laser chip consists of three sections: a gain section for lasing, and phase and DBR sections for wavelength control. A micro-heater is lithographically integrated on the top of the DBR
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba628ac1bb778088fb1fa8ff9969e18f
https://doi.org/10.1117/12.907112
https://doi.org/10.1117/12.907112
Autor:
Gordon Charles Brown, Dragan Pikula, Yabo Li, Garrett Andrew Piech, Wayne Liu, Chung-En Zah, Albert Heberle, Douglas Llewellyn Butler, Nick Visovsky, Jin Li
Publikováno v:
IEEE Photonic Society 24th Annual Meeting.
We report a compact green light source consisting of a 1060-nm DBR laser, a periodically poled lithium niobate crystal waveguide and an adaptive optic element consisting of a micro-electro-mechanical system actuator. Up to 350 mW optical power at 530
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9514757a724740c8c21f3531160e941a
https://doi.org/10.1109/pho.2011.6110541
https://doi.org/10.1109/pho.2011.6110541