Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Gangru Li"'
Publikováno v:
The Journal of Engineering (2018)
Voltage sourced converter (VSC) high-voltage direct current (HVDC) is moving to higher DC voltage and capacity, such as ±500 kV/3000 MW and ±800 kV/5000 MW for a single converter, which will bring tremendous challenges for converter submodule desig
Externí odkaz:
https://doaj.org/article/57bb1453c6444d7b8b1204e492a98c85
Publikováno v:
15th IET International Conference on AC and DC Power Transmission (ACDC 2019).
As an emerging type of electrical equipment, design and testing of DC circuit breaker face enormous challenges. Hybrid DC circuit breaker is one of mainstream design solutions, and its commutation branch is normally based on power switches typically
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::769d4743eec682d891a31c5b205d188a
https://doi.org/10.1049/cp.2019.0081
https://doi.org/10.1049/cp.2019.0081
Publikováno v:
The Journal of Engineering (2018)
Voltage sourced converter (VSC) high-voltage direct current (HVDC) is moving to higher DC voltage and capacity, such as ±500 kV/3000 MW and ±800 kV/5000 MW for a single converter, which will bring tremendous challenges for converter submodule desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f2036e766a83100f847092a80260413e
https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8927
https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8927
Publikováno v:
2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
The IGBT press-pack provides low inductance and simple module stack for high power and high voltage applications. In this work, the reliability of IGBT Press-Pack power modules is experimentally tested under RBSOA conditions to investigate their limi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85dc55ff758f632331276c71727267c2
https://doi.org/10.1109/apec.2017.7931082
https://doi.org/10.1109/apec.2017.7931082
Publikováno v:
IEEE Conference Record - Abstracts. PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference (Cat. No.01CH37255).
Summary form only given as follows. The semiconductor switch has been shown to be a realistic alternative to the thermionic device in pulse power applications. The introduction of new press-pack IGBT technology offers the opportunity to extend the ra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::711918c794bfac1c65c31830b3d08b2f
https://doi.org/10.1109/ppps.2001.960944
https://doi.org/10.1109/ppps.2001.960944
Autor:
Yalan Wang, Palmer, Patrick R., Bryant, Angus T., Finney, Stephen J., Abu-Khaizaran, Muhammad S., Gangru Li
Publikováno v:
IEEE Transactions on Industry Applications; Mar/Apr2009, Vol. 45 Issue 2, p861-870, 10p, 6 Black and White Photographs, 4 Diagrams, 3 Charts, 13 Graphs
Publikováno v:
PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science & 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251); 2001, p1051-1051, 1p
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Akademický článek
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