Zobrazeno 1 - 10
of 201
pro vyhledávání: '"Ganesh Subbarayan"'
Autor:
Tongjun Niu, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, Xinghang Zhang
Publikováno v:
Crystals, Vol 13, Iss 7, p 989 (2023)
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength o
Externí odkaz:
https://doaj.org/article/790dde08963040b29a9fcd386f55b3bc
Publikováno v:
Algorithms, Vol 15, Iss 7, p 245 (2022)
In analysis of problems with parametric spline boundaries that are immersed or inserted into an underlying domain, the discretization on the underlying domain usually does not conform to the inserted boundaries. While the fixed underlying discretizat
Externí odkaz:
https://doaj.org/article/a8e90e1bde58465ca6c97dfd90dbeb3e
Publikováno v:
Algorithms, Vol 13, Iss 4, p 82 (2020)
Point projection is an important geometric need when boundaries described by parametric curves and surfaces are immersed in domains. In problems where an immersed parametric boundary evolves with time as in solidification or fracture analysis, the pr
Externí odkaz:
https://doaj.org/article/54dd2123a2b9419a82ee488cecac5384
Autor:
Colin Young, Ganesh Subbarayan
Publikováno v:
Entropy, Vol 21, Iss 10, p 967 (2019)
In the present work, we propose using the cumulative distribution functions derived from maximum entropy formalisms, utilizing thermodynamic entropy as a measure of damage to fit the low-cycle fatigue data of metals. The thermodynamic entropy is meas
Externí odkaz:
https://doaj.org/article/22f1b2daaf81452a8a5b988e7859a254
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:426-443
Publikováno v:
International Journal of Fracture. 238:35-56
Autor:
Zhang, Tongjun Niu, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, Xinghang
Publikováno v:
Crystals; Volume 13; Issue 7; Pages: 989
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength o
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:740-759
Publikováno v:
International Journal for Numerical Methods in Engineering. 123:1547-1575
Publikováno v:
Advances in Applied Mechanics ISBN: 9780323992480
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ef4982eb6b6107c119e6db045fe02d4
https://doi.org/10.1016/bs.aams.2022.09.002
https://doi.org/10.1016/bs.aams.2022.09.002