Zobrazeno 1 - 10
of 284
pro vyhledávání: '"Ganesh Subbarayan"'
Autor:
Tongjun Niu, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, Xinghang Zhang
Publikováno v:
Crystals, Vol 13, Iss 7, p 989 (2023)
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength o
Externí odkaz:
https://doaj.org/article/790dde08963040b29a9fcd386f55b3bc
Publikováno v:
Algorithms, Vol 15, Iss 7, p 245 (2022)
In analysis of problems with parametric spline boundaries that are immersed or inserted into an underlying domain, the discretization on the underlying domain usually does not conform to the inserted boundaries. While the fixed underlying discretizat
Externí odkaz:
https://doaj.org/article/a8e90e1bde58465ca6c97dfd90dbeb3e
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:426-443
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f52b6bb1847e74d7c2210f5be899be4a
https://doi.org/10.1109/tcpmt.2023.3259299
https://doi.org/10.1109/tcpmt.2023.3259299
Publikováno v:
International Journal of Fracture. 238:35-56
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4fc0e4ba8bc23a8d7a63aa949d272c3
https://doi.org/10.1007/s10704-022-00649-9
https://doi.org/10.1007/s10704-022-00649-9
Autor:
Zhang, Tongjun Niu, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, Xinghang
Publikováno v:
Crystals; Volume 13; Issue 7; Pages: 989
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=multidiscipl::8b9a0c4ff2a2431cc0d39cb01e763727
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:740-759
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ec2995c44f2827a6fe05abf71fe40ec
https://doi.org/10.1109/tcpmt.2022.3167651
https://doi.org/10.1109/tcpmt.2022.3167651
Publikováno v:
International Journal for Numerical Methods in Engineering. 123:1547-1575
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ec21256844a127685e22858ed0a027e
https://doi.org/10.1002/nme.6902
https://doi.org/10.1002/nme.6902
Publikováno v:
Advances in Applied Mechanics ISBN: 9780323992480
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ef4982eb6b6107c119e6db045fe02d4
https://doi.org/10.1016/bs.aams.2022.09.002
https://doi.org/10.1016/bs.aams.2022.09.002
Publikováno v:
Algorithms, Vol 13, Iss 4, p 82 (2020)
Point projection is an important geometric need when boundaries described by parametric curves and surfaces are immersed in domains. In problems where an immersed parametric boundary evolves with time as in solidification or fracture analysis, the pr
Externí odkaz:
https://doaj.org/article/54dd2123a2b9419a82ee488cecac5384
Autor:
Colin V. Greene, Ganesh Subbarayan, Yifan Wu, Raiyo Aspandiar, Nilesh Badwe, John E. Blendell, Carol A. Handwerker, Sukshitha Achar Puttur Lakshminarayana, Yaohui Fan, Travis F. Dale
Publikováno v:
Journal of Electronic Materials. 50:6615-6628
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2012887ba2cbbd03464dd80d2889a5b
https://doi.org/10.1007/s11664-021-09256-1
https://doi.org/10.1007/s11664-021-09256-1