Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ganesh Pandiarajan"'
Autor:
Christopher Greene, Daryl Santos, Abid Alrahman Fawzi Abbas, Krishnaswami Srihari, Ganesh Pandiarajan, Satyanarayan Shivkumar Iyer
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1861-1867
A conformal coating is a protective chemical material that can be applied as a thin layer on printed circuit board assemblies (PCBAs). The purpose of conformal coating is to prevent the interaction between external environmental factors and the elect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10f52504012b877add7ff17a358896f2
https://doi.org/10.1109/tcpmt.2020.3027635
https://doi.org/10.1109/tcpmt.2020.3027635
Autor:
Daryl Santos, Christopher Greene, Krishnaswami Srihari, Ganesh Pandiarajan, Abid-Alrahman Fawzi Abbas
Publikováno v:
Procedia Manufacturing. 38:1138-1142
Conformal coating is a protective chemical material, such as acrylic, silicon, parylene or urethane, that can be applied as a thin layer on printed circuit board assemblies. The purpose of conformal coating is to prevent moisture, corrosive chemicals
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a6957e19e8d205d46cad2e533b321e2
https://doi.org/10.1016/j.promfg.2020.01.202
https://doi.org/10.1016/j.promfg.2020.01.202
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Electronic products are subject to a lot of different types of drop/shock loading during shipping and handling. The huge impact and acceleration would be transmitted to electronic products and its shipping container which will cause mechanical failur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aeb3b7bb93dbf52f69b4aeb829717820
https://doi.org/10.1109/ectc32696.2021.00337
https://doi.org/10.1109/ectc32696.2021.00337
Autor:
Ross Havens, Krishnaswami Srihari, Ganesh Pandiarajan, Gurudutt Chennagiri, Satyanarayan Shivkumar Iyer
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
There is a continuous need for higher density memory modules for applications like servers, telecommunications, and networking. Memory modules with package stacked Dynamic Random-Access Memory (DRAM) devices were developed for these applications. Sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a98418f4c3d08bd8a748fbe45dbc41e
https://doi.org/10.1109/ectc.2013.6575816
https://doi.org/10.1109/ectc.2013.6575816