Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Gaetano Sequenzia"'
Publikováno v:
International Journal of Thermofluids, Vol 22, Iss , Pp 100609- (2024)
The objective of this study was to develop a Computational Fluid Dynamics (CFD) 3D model for an industrial application, to investigate how surface roughness affected pressure drop and thermal performance in the ACEPACKTM DRIVE, a commercial SiC-based
Externí odkaz:
https://doaj.org/article/9de996a603b241849cc1efc883763025
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction
Publikováno v:
IEEE Access, Vol 9, Pp 22859-22867 (2021)
Solder reliability is a key aspect for the packaging of low voltage power semiconductor device. The interconnections among package components, e.g. the silicon chip and copper leadframe, and between package itself and the external printed control boa
Externí odkaz:
https://doaj.org/article/1ec7a055cf1444fab46ecf98dce63917
Publikováno v:
IEEE Access, Vol 9, Pp 76307-76314 (2021)
Semiconductor power modules are the key hardware components of a traction inverter. It drives motor speed and torque, managing the energy exchange from battery to motor and viceversa. The increasing demand for electric and hybrid vehicle requests hig
Externí odkaz:
https://doaj.org/article/8b935d07b55e436da2de2b2cc82b325a
Autor:
Giuseppe Mauromicale, Alessandro Sitta, Michele Calabretta, Salvatore Massimo Oliveri, Gaetano Sequenzia
Publikováno v:
Applied Sciences, Vol 11, Iss 18, p 8302 (2021)
New technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been develo
Externí odkaz:
https://doaj.org/article/a0de6dee00804a36991c93670eb9ef65
Publikováno v:
Applied Sciences, Vol 11, Iss 15, p 7012 (2021)
The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and
Externí odkaz:
https://doaj.org/article/2b60ef1ff7114b7da01394b37a1e6c1b
Publikováno v:
Applied Sciences, Vol 11, Iss 11, p 5140 (2021)
Electrochemical deposited (ECD) thick film copper on silicon substrate is one of the most challenging technological brick for semiconductor industry representing a relevant improvement from the state of art because of its excellent electrical and the
Externí odkaz:
https://doaj.org/article/937e6fbdc31f45779480184bd87ef2c5
Autor:
Alessandro Sitta, Giuseppe Mauromicale, Marco Alfio Torrisi, Gaetano Sequenzia, Giuseppe D’Arrigo, Michele Calabretta
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0115a10c70559329c33a6280a9f14f56
https://doi.org/10.1109/eurosime56861.2023.10100749
https://doi.org/10.1109/eurosime56861.2023.10100749
Publikováno v:
International Journal on Interactive Design and Manufacturing (IJIDeM). 16:167-176
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::89c98cb51f78a904409f87418fea1840
https://doi.org/10.1007/s12008-021-00815-8
https://doi.org/10.1007/s12008-021-00815-8
Autor:
Michele Calabretta, Alessandro Sitta, Giuseppe Mauromicale, Francesco Rundo, Gaetano Sequenzia, Angelo Alberto Messina
Publikováno v:
2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0916ff79ef8d5e7c3768ceb307ffd83c
https://doi.org/10.1109/asdam55965.2022.9966752
https://doi.org/10.1109/asdam55965.2022.9966752
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. :095440542311698
The hybrid and battery electric vehicle market is heavily increasing the demand for semiconductor power modules. The manufacturing of such products is more complex than discrete devices. Some parameters, such as module deformation (warpage), play a m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3523a9bcdb9d4fb90bf9ed27dc9c7edf
https://doi.org/10.1177/09544054231169812
https://doi.org/10.1177/09544054231169812