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pro vyhledávání: '"Gabriel Zier"'
Autor:
Jessica Reitz, Ilias Nikolaidis, Anton Miric, Melanie Bawohl, Gabriel Zier, Mark Challingsworth, Kai Herbst, Christina Modes, Paul Gundel
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000073-000078
So far Direct Bonded Copper (DBC) substrates have been the standard for power electronics. They provide excellent electrical and thermal conductivity at low cost. Weaknesses of DBC technology are the inevitable warpage and the relatively low reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0329da87e906ab4ee7a59e875efbdd8a
https://doi.org/10.4071/2016cicmt-tp2b2
https://doi.org/10.4071/2016cicmt-tp2b2
