Non invasive backscattering light to detection of endothelial cells activity for graft sorting: Proof of consent

Autor: Emmanuel Bergeret, Laure Siozade Lamoine, Marion Gil, Laetitia Abel Tiberini, Carole Deumié, Gaëlle Georges

Publikováno v: Results in Optics
Results in Optics, 2021, 4, pp.100082. ⟨10.1016/j.rio.2021.100082⟩
Results in Optics, Vol 4, Iss, Pp 100082-(2021)
Results in Optics, Elsevier, 2021, 4, pp.100082. ⟨10.1016/j.rio.2021.100082⟩

International audience; In tissue bank, one of the key steps in the corneal grafts sorting is the analysis of the deepest cell layer of the cornea, the endothelium. This analysis consists of counting the density of living cells using trypan blue stai

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e3ef6af7244c7e3503224494d188ec19
https://hal.science/hal-03463874/document

The light behavior from Shallow Trench Isolation profiles at Chemical Mechanical Planarization step and correlation with optical endpoint system by interferometry

Autor: Jacques Pinaton, Emilie Faivre, Jakey Blue, Agnes Roussy, Sophia Bourzgui, Gaëlle Georges

Publikováno v: Reflection, Scattering, and Diffraction from Surfaces VI
Reflection, Scattering, and Diffraction from Surfaces VI, Aug 2018, San Diego, United States. pp.11, ⟨10.1117/12.2320966⟩

International audience; In the semiconductor manufacturing, the control of Chemical-Mechanical Planarization (CMP) process time for Shallow Trench Isolation (STI) is important. A wafer under-or over-polishing causes leakage and short-circuits making

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::36af216ebaacb95141b0d76d2f09587f
https://hal.science/hal-02415466/document

Embedded spectroscopic reflectometry metrology on FEOL silicon dioxide trench polishing equipment: ER: Equipement reliability and productivity enhancements

Autor: Jakey Blue, Agnes Roussy, Emilie Faivre, Jacques Pinaton, Gaëlle Georges, K. Labory, S. Bourzgui

Publikováno v: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Advanced Semiconductor Manufacturing Conference (ASMC 2017 )
Advanced Semiconductor Manufacturing Conference (ASMC 2017 ), May 2017, Saratoga Springs, United States. ⟨10.1109/ASMC.2017.7969267⟩

International audience; The challenge in the research is to develop a material thickness measurement method to monitor oxide polishing by Chemical-Mechanical Planarization (CMP) in the Shallow Trench Isolation (STI). The underlying aim is to build a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7c8599ed75f2358eca283498bd684029
https://hal.science/hal-01622569/file/2017_ASMC.pdf

Optical far field measurements applied to microroughness determination of periodic microelectronic structures

Autor: Alexandre Vauselle, Carole Deumié, Philippe Maillot, Gaëlle Georges

Publikováno v: SPIE Proceedings.

With device size reduction, variability induced by local micro roughness is becoming less and less negligible in terms of statistical control of critical dimensions (CD). We applied a recent approach developed at Fresnel Institute for the determinati

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ae12646f44a77c3caa16b3a4aedf5b9c
https://doi.org/10.1117/12.879436

Micro Roughness Determination Of Periodic Microelectronics Structures Using Optical Far Field Measurements

Autor: Alexandre Vauselle, Philippe Maillot, Gaëlle Georges, Carole Deumié, David G. Seiler, Alain C. Diebold, Robert McDonald, Amal Chabli, Erik M. Secula

Publikováno v: AIP Conference Proceedings.

The recent advance in lithography process leads to microelectronics compound size reduction. As a direct consequence, micro roughness should not be negligible compared to critical dimension. That is why a novel approach has been developed using an an

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2cb58b7d070af84c1f60edb08990d614
https://doi.org/10.1063/1.3657909