Zobrazeno 1 - 10
of 55
pro vyhledávání: '"GAY SAMUELSON"'
Autor:
Gay Samuelson
Publikováno v:
EDFA Technical Articles. 5:5-10
The Assembly Analytical Forum (AAF) is an organization under the auspices of the Sematech Quality Council. The AAF charter is to develop Packaging Analytical Roadmaps five to ten years into the future that are consistent with the International Techno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a199f39e6fad0393d4cb8b4c0e530b75
https://doi.org/10.31399/asm.edfa.2003-4.p005
https://doi.org/10.31399/asm.edfa.2003-4.p005
Autor:
Thomas M. Moore, Gay Samuelson, Cheryl D. Hartfield, Rajen Dias, Deepak Goyal, Shalabh Tandon
Publikováno v:
EDFA Technical Articles. 3:15-19
Over the last few years, new challenges increased the pressure on packaging and assembly analytical resources. Reduced product development cycle time, increased market segmentation, new package and die level materials, ever shrinking device geometrie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82bc5dbccce77da8a3d83829f904dc8a
https://doi.org/10.31399/asm.edfa.2001-4.p015
https://doi.org/10.31399/asm.edfa.2001-4.p015
Publikováno v:
JOM. 51:19-21
This article addresses the subtle changes necessary to achieve a margin against an intrinsic failure mechanism in a highly time-constrained development world. The problem of a coefficient of thermal expansion mismatch between a liquid crystal polymer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77aedf68ec0fb1286070292d9def537f
https://doi.org/10.1007/s11837-999-0022-x
https://doi.org/10.1007/s11837-999-0022-x
Publikováno v:
The 1998 international conference on characterization and metrology for ULSI technology.
Next generation assembly/package development challenges are primarily thermal mechanical as interconnect levels increase and product performance drives the need for increased speed and power dissipation. The results of this trend present some distinc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4111b7392d2a8eb97db67a6a5fcf15a
https://doi.org/10.1063/1.56847
https://doi.org/10.1063/1.56847
Publikováno v:
Cancer Research. 70:433-433
There has been little improvement in glioblastoma multiforme (GBM) patient prognosis over the past 20 years despite advances in imaging, neurosurgery, post-operative care, radiation delivery and chemotherapy. One reason for treatment failure is the h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad9e2d8c806e1d71d8a945deff3f0412
https://doi.org/10.1158/1538-7445.am10-433
https://doi.org/10.1158/1538-7445.am10-433
Autor:
GAY SAMUELSON
Publikováno v:
ACS Symposium Series ISBN: 9780841207158
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3f78c94fc2931da08742824ff51ddcf
https://doi.org/10.1021/bk-1982-0184.ch008
https://doi.org/10.1021/bk-1982-0184.ch008
Autor:
He, Ping1,2, Philbrick, Melissa J.2 jli@bidmc.harvard.edu, An, Xiaojin2, Wu, Jiaping2, Messmer-Blust, Angela F.2, Li, Jian2
Publikováno v:
PLoS ONE. Feb2014, Vol. 9 Issue 2, p1-9. 9p.
Autor:
Oates, A.S.
Publikováno v:
IEEE Transactions on Device & Materials Reliability; Mar2004, Vol. 4 Issue 1, p3-3, 1p
Conference
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Conference
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