Zobrazeno 1 - 10
of 125
pro vyhledávání: '"G.V. Kopcsay"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:279-287
In this paper, the effect of metal roughness on the total loss, the extracted tandelta, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing charac
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:11-20
A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with fr
Autor:
R. A. Haring, Paul W. Coteus, G. L.-T. Chiu, G.V. Kopcsay, Dong Chen, Pavlos M. Vranas, Martin Ohmacht, Alan Gara, Todd E. Takken, Burkhard Steinmacher-Burow, Philip Heidelberger, T. A. Liebsch, Mark E. Giampapa, Matthias A. Blumrich, Dirk Hoenicke
Publikováno v:
IBM Journal of Research and Development. 49:195-212
The Blue Gene®/L computer is a massively parallel supercomputer based on IBM system-on-a-chip technology. It is designed to scale to 65,536 dual-processor nodes, with a peak performance of 360 teraflops. This paper describes the project objectives a
Autor:
Alan Gara, Richard A. Swetz, Paul W. Coteus, Todd E. Takken, Alphonso P. Lanzetta, Lawrence Shungwei Mok, G.V. Kopcsay, M. J. Jeanson, Thomas Mario Cipolla, P. La Rocca, Paul G. Crumley, C. M. Marroquin, Harry R. Bickford, P. R. Germann, Rick A. Rand, Shawn A. Hall
Publikováno v:
IBM Journal of Research and Development. 49:213-248
As 1999 ended, IBM announced its intention to construct a one-petaflop supercomputer. The construction of this system was based on a cellular architecture--the use of relatively small but powerful building blocks used together in sufficient quantitie
Autor:
Barry J. Rubin, G.V. Kopcsay, Bruce J. Chamberlin, T.-M. Winkel, George A. Katopis, C.W. Surovic, Roger S. Krabbenhoft, Alina Deutsch
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:4-12
In this paper, the self-consistent, frequency-dependent dielectric constant epsivr(f) and dielectric loss tandelta(f) of several materials are determined over the range 2 to 30 GHz using a short-pulse propagation technique and an iterative extraction
A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis
Publikováno v:
IEEE Transactions on Advanced Packaging. 27:71-78
This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transf
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 10:695-711
Although three-dimensional (3-D) partial inductance modeling costs have decreased with stable, sparse approximations of the inductance matrix and its inverse, 3-D models are still intractable when applied to full chip timing or crosstalk analysis. Th
Autor:
C.W. Surovic, P.W. Bond, Todd E. Takken, Alphonso P. Lanzetta, Alina Deutsch, Paul W. Coteus, G.V. Kopcsay
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:102-117
This paper compares several differential cable characteristics that were evaluated for multi-Gb/s data-rates for both data and clock paths for 1-10 m lengths. Time-domain measurements are shown for the unassembled and connectorized cables and for rep
Autor:
Daniel C. Edelstein, Byron L. Krauter, Howard H. Smith, Paul W. Coteus, C.W. Surovic, G.V. Kopcsay, Alina Deutsch, P.L. Restle
Publikováno v:
Proceedings of the IEEE. 89:529-555
This paper reviews the status of present day on-chip wiring design methodologies and understanding. A brief explanation is given of the fundamental transmission-line properties that should be considered for accurate prediction of crosstalk, common-mo
Autor:
G.V. Kopcsay, C.W. Surovic, Barry J. Rubin, Alina Deutsch, T. Gallo, R.H. Dennard, L.M. Terman, R.P. Dunne
Publikováno v:
IBM Journal of Research and Development. 39:547-567