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Processes and procedures were developed for applying the thin film tungsten electrical intraconnections to the MC2730 RTG ''one-dimensional'' thermopile. After polishing, the surface to be metallized was cleaned with a detergent/organic solvent proce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c70b9c7845572e4f3ea2cf9a2702775
https://doi.org/10.2172/7192063
https://doi.org/10.2172/7192063
