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pro vyhledávání: '"G.J. Dishon"'
Autor:
G.J. Dishon, S.M. Bobbio
Publikováno v:
Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle.
Summary form only given. With the shrinking sizes of all electronic components and bonding pads, the very fast growth of surface-mount technology (SMT), and the greater demand for flip-chip device bonding, both fluxing and cleaning steps are becoming
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fc876c13c25bb11b09f24ad1a99884e
https://doi.org/10.1109/emts.1988.16145
https://doi.org/10.1109/emts.1988.16145
Autor:
G.J. Dishon
Publikováno v:
Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle.
Summary form only given. The two basic approaches that are currently being used to build solder bumps-wet electroplating and dry evaporation-are subject to strong limitations that prevent a wider application throughout the electronics industry. These
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6291e4acf703b32f35c0ff9f751a7641
https://doi.org/10.1109/emts.1988.16160
https://doi.org/10.1109/emts.1988.16160
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